Test & Measurement World - June 1, 2008
Features
From tape-out to yield
Nanometer semiconductor devices present significant validation, characterization, and analysis challenges as designs move from tape-out to high-volume production. To help chip makers get such devices to market quickly, Presto Engineering deploys a variety of test and analysis equipment and expertise.
- Departments
- Editor's Note
- Green engineering matures
- News Briefs
- News Briefs
- Test Voices
- Opaque Windows
- Viewpoint
- How DFT conquers chip complexity
- Features
- Data Acquisition
- Design tradeoffs in data acquisition
- Project Profile
- No power interrupts, please
- RF/Wireless Test
- Protocol stack testing for LTE
- Machine-Vision and Inspection Test Report
- Editor's Note
- Looking through inspection's crystal ball
- Highlights
- Highlights
- Machine-Vision and Inspection Report
- MEMS create 3-D inspection challenges
- Where to put AOI?
- Complex circuits challenge cameras
- Market Trends
- Automated Test Equipment
- Trying times in semiconductor ATE market
- Product Update
- Featured Products
- Analyze HDMI audio streams
- Simulate and develop wireless systems
- Sensor captures vehicle crush zone data
- Test system supports all A-GPS test cases
- 300-MHz PXI, PCI, and VXI oscilloscopes
- Lock-in amplifier boasts low noise
- Power amplifier delivers 40 kV
- Hipot wire harness tester
- USB DMM has 6½ digits
- A 12-GHz PC-based oscilloscope
- Xantrex introduces triple-output digital power supplies
- Event data recorder integrates F-RAM memory
- Tech Trends
- Instrumentation
- Oscilloscopes support the video craze
- Test Digest
- Environmental Test
- Improve thermal cycling time
- Instruments
- When power supplies don't meet specs
- Webcast
- Inject voltage pulses and troubleshoot
Advertisement


