Test & Measurement World - October 1, 2008

The semiconductor industry has long relied on scan ATPG tools instead of functional test to create stimulus-response patterns with very high fault coverage. But the higher-than-normal power consumption of ATPG can cause device damage or false failures.

• Departments
• Editor's Note
• Innovation should be focus of next president
• News Briefs
• News Briefs
• Show Highlights
• EMC in the Motor City
• Calibration at Disney World
• Test Voices
• Magnetic field sensors [sic]
• Viewpoint
• Time to break away from "big iron"?

• Features
• Awards
• Vote for the 2009 Test Engineer of the Year
• Communications Test
• Cooperation to compliance with SFP+
• Instrumentation
• RF modules pose tough test challenges
• Test Ideas
• Test Ideas: Serial port controls ADC

• Machine-Vision and Inspection Test Report
• Editor's Note
• Machine vision's changing times
• Highlights
• Highlights
• Machine-Vision and Inspection Report
• CMOS cameras rival their CCD cousins
• GigE Vision expands in machine vision
• SEM technology sees below 1 nm
• Products
• Basler adds color line-scan cameras
• SVS-Vistek recorder captures high-speed events
• Point Grey adds USB 2.0 digital cameras

• Market Trends
• Triple-Play Test
• Demand grows for multiple-services testing

• Product Update
• Featured Products
• Measurement Computing releases PCIe DIO boards
• Agilent enhances WiMAX drive test
• EXFO software examines 40G network operation
• Measure current in the calibration lab
• DTVinteractive unveils ATSC-M/H signal generator
• Keithley debuts 8x8 MIMO test system
• IR thermometer uses visible light camera
• Instrument senses temperature and humidity
• PXI embedded controller increases speed to 2.53 GHz
• BNC digital delay generator furnishes eight timing channels

• Tech Trends
• Instrumentation
• USB 3.0 is coming

• Test Digest
• Data Acquisition
• Thermocouples often described incorrectly
• Instruments
• All measurements are estimates

• Viewpoint
• Time to break away from "big iron"? (continued)