Aries debuts 6.5-mm center probe test socket for test and burn-in
-- Test & Measurement World, 11/1/2008 2:00:00 AM
Aries Electronics has introduced a high-frequency center probe test socket in a standard molded format that enables the socket to accommodate any 6.5-mm or smaller CSP, MicroBGA, DSP, LGA, SRAM, DRAM, or flash device. The socket is available with machined or custom-molded pressure pads and interposers, and its pressure pad compression spring allows for height variation in device thickness and provides proper force against the device. The socket can be easily mounted to and be removed from a PCB (printed circuit board) using two stainless-steel mounting screws.
The spring probes feature contact forces of 15 g per contact on 0.30-mm to 0.35-mm pitches, 16 g per contact on 0.40-mm to 0.45-mm pitches, and 25 g per contact on 0.50-mm pitches or larger. The socket offers less than 40 mΩ of contact resistance, an operating temperature range of –55°C to 150°C, and a contact life of an estimated 500,000 cycles minimum.
Base price: 100-lead socket—$125. Aries Electronics, www.arieselec.com.
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