ATE/DFT/BIST: 2009 Buyer's Guide
Use our updated buyer's guide to find the products you need.
-- Test & Measurement World, 7/1/2009 2:00:00 AM
Our 2009 Buyer's Guide contains more than 60 product and service categories, divided into five main sections with a total of 16 subsections. Each subsection includes hotlinked vendor names.
In this section:
Production Test Equipment Accessories & Software: ATE/Production Test/QA Third-Party Services: Production Test
Return to the main 2009 Buyer's Guide page
Sampling of products from the past year
System tests 256 DDR3 devices in parallel
An expanded configuration of the Advantest T5503 high-speed memory test system offers parallel test capability of up to 256 DDR3 devices—double that of the previous T5503 model. The expanded configuration, known as the T5503 8448 Channel Test Head, works with Advantest’s M6242 handler to form a complete DDR3 test cell. An optional pin card is available that preserves the 256-DUT (device under test) parallel test capacity for high-speed, high-pin-count stacked DRAM. The system can test DDR3-SDRAM, GDDR3, GDDR4, and other memory devices, with test speeds to 3.2 Gbps. Advantest, www.advantest.com.
Probe system has DC and RF configurations
SemiProbe has created a low-cost multifunctional probe system suitable for R&D applications that involve simple probing operations yet require system flexibility and reliability. The LA-150 Lab Assistant comes in DC and RF/microwave configurations, both of which allow individual manipulator or probe-card contact to the DUT.
The standard configuration comes with two DC manipulators; a trinocular, stereo-zoom microscope; a 150-mm vacuum chuck; and a platen that provides 360° of manipulator placement and that has a built-in 4.5-in. probe-card holder. The system may be upgraded to add x-y linear stages (chuck and microscope), a CCTV system, vibration isolation, a thermal chuck, and additional manipulators with a variety of probe arm and base choices. SemiProbe, www.semiprobe.com.
Tester handles both flash memory and DRAM
Verigy’s V6000 testers enable engineers to test both flash and DRAM memory on the same automated test platform by simply changing to a new test program and probe card. The V6000 family includes the V6000e, which supports memory test-program development and device characterization; the V6000 WS, which enables 300-mm one-touchdown wafer-sort probing; and the V6000 FT, which performs single-insertion final test of flash, DRAM, or MCPs (multichip packages) that include both flash and DRAM memory. All V6000 systems include Verigy’s Active Matrix technology, which provides massive parallelism, supporting more than 18,000 I/O pins and more than 4000 programmable power supplies. The V6000 offers scalable AC performance at 140, 280, 560, and up to 880 Mbps. Verigy, www.verigy.com.
Boundary-scan I/O module offers external stimulus
The JT 2149/MPV DIOS (digital I/O scan) module from JTAG Technologies provides test access to printed-circuit boards requiring external I/O stimulus and response monitoring. The MPV (multi-programmable/multi-voltage) DIOS plugs directly into the company’s QuadPOD, the standard front-end of its Data-Blaster series of boundary-scan controllers. When connected to a circuit board via the edge connector or fixture test pins, the module exercises the board’s connections in synchronization with the boundary-scan infrastructure. The DIOS module supports the vendor’s SCIL (Scan Configurable Interface Logic) technology to allow custom functions such as pattern generators, counters, and bus simulators to be factory formatted for advanced functional and pattern-oriented testing. JTAG Technologies, www.jtag.com.
Test platform gains digital subsystems
LTX-Credence extended the capabilities of its X-Series test platform with the introduction of two digital subsystem options. The FX2 offers double the digital pin count per instrument of the FX1 subsystem, enabling higher levels of multisite test. It offers improved scan chaining for multisite testing, high-voltage pin-electronic capability for embedded flash testing, full-featured synchronization, and independent timing domains to support multiple periods running simultaneously. The FX-HS targets the test requirements of high-speed I/O, including DDR parallel and MIPI SerDes interfaces. A real-time protocol-detect feature simplifies test development and can be used to reduce the test time of high-speed I/O by up to 30%. The FX-HS provides high-speed digital pattern rates up to 800 Mbps. LTX-Credence, www.ltx-credence.com.
Avionics platform enables mixed-signal test
Based on the 14-slot GX7102A PXI platform and providing multichannel ARINC429 and MIL-STD-1553 interfaces, the GBATS (Geotest Basic Automated Test System) offers a variety of options for analog, digital, and mixed-signal test applications. The modular system addresses both military and commercial avionics test applications for depot and maintenance repair overhaul facilities.
The GBATS is equipped with a 960-pin UUT interface that provides access to all system resources. In addition to the ARINC429 and MIL-STD-1553 interfaces, the system can be configured with a synchro/resolver, an arbitrary waveform generator, a dual-channel digitizer, a counter/timer, a multichannel voltage source, digital cards supporting vector rates of up to 200 MHz, and a high-density static I/O card. Geotest – Marvin Test Systems, www.geotestinc.com.
| In this section: Production Test Equipment Accessories & Software: ATE/Production Test/QA Third-Party Services: Production Test Return to the main 2009 Buyer's Guide page |
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