Solder-paste inspection system

Staff -- Test & Measurement World, 2/1/2007 2:00:00 AM

Agilent Technologies has introduced the Medalist SP50 Series 3 solder-paste inspection system for inspecting printed-circuit-board assemblies. Systems in the Medalist SP50 family offer interchangeable lighting heads and can be deployed at paste or pre- or post-solder as needs change. Links to downstream repair stations and statistical process control tools help users increase yields and improve board quality. Agilent Technologies, www.agilent.com.

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