Test socket gets adjustable pressure pad

-- Test & Measurement World, 6/1/2009 2:00:00 AM

Aries Electronics now offers its 27-mm CSP/MicroBGA (chip-scale package/micro-ball-grid array) test and burn-in sockets with an optional adjustable pressure pad. With only a 0.010-in. (0.254-mm) displacement per revolution of the screw, this mechanism makes the sockets suitable for testing devices with large height tolerances as well as for testing small, fragile devices (such as thin or ceramic chips) without causing damage.

Users can back off the adjusting screw and close the socket’s lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw to ensure good contact. The screw can also be adjusted based on device height from chip to chip, eliminating socket rework downtime to design a new pressure pad.

Each adjustable pressure pad comes with a user-adjustable washer stack in 0.001-in. (0.0265-mm) and 0.010-in. (0.254-mm) increments that serves as a hard stop to eliminate device over-compression. If constant large device height changes are expected during testing, the washer stack can be removed without affecting the socket’s performance.

The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices from 6.5 mm² to 55 mm² by using machined or custom-molded pressure pads and interposers. Signal path is only 0.077 in. (1.96 mm). Contact forces are 15 g per contact on a 0.30-mm to 0.35-mm pitch, 16 g per contact on a 0.40-mm to 0.45-mm pitch, and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is –55°C to +150°C, and estimated contact life is a minimum of 500,000 cycles.

Price: pressure-pad option—$60 per pad for socket quantities of 50 or more. Aries Electronics, www.arieselec.com.

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