Highlights
-- Test & Measurement World, 10/1/2008 2:00:00 AM
Microscan acquires Siemens’ M-V business
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In September, Microscan announced plans to acquire the Siemens Machine Vision business, which was originally Acuity CiMatrix, the company that developed the 2-D Data Matrix code. Microscan, a manufacturer of precision data-acquisition and control products used in the electronics, life sciences, and automotive industries, plans to keep the division’s headquarters in Nashua, NH, open and to retain the majority of the workforce.
“Vision products for identification and inspection are a growing aspect of the precision data-acquisition and control market,” said Jeff Timms, president of Microscan. “The acquisition of the Siemens Machine Vision business brings with it a depth of expertise in Data Matrix and vision product design that is second to none. Combined with Microscan’s deep experience in data-acquisition solutions, the purchase of this business tremendously augments our product portfolio and brings with it a unique and complementary offering to our customers.”
According to Dennis Sadlowski, president and CEO of Siemens Energy & Automation, Siemens will continue to produce industrial identification (Auto ID) and RFID code-reading systems. www.microscan.com.
Stemmer announces CVB version 10
Stemmer Imaging has introduced version 10 of its Common Vision Blox (CVB) programming library. In addition to CVB’s hardware independence and connection flexibility, Version 10 includes a new installation routine and support for the 32-bit version of Microsoft Windows Vista.
The Version 10 installation procedure makes system restarts unnecessary, even after the installation of the hardware drivers. Once the software is installed, all system settings can be accessed via a central management console.
The update is free for registered users of Common Vision Blox, and a free 14-day full version is also available for evaluation. www.commonvisionblox.com.
Zeiss rolls out electron microscopes
Carl Zeiss SMT has launched a new SEM (scanning electron microscope) as well as an argon ion beam column for its NVision 40 CrossBeam nanoscale workstation. Based on the company’s Gemini field-emission technology, the new Sigma SEM accommodates specimens up to 250 mm in diameter and 145 mm tall and performs material analysis at high resolution using both energy-dispersive and wavelength-dispersive x-ray spectroscopy techniques. In addition, its coplanar chamber design allows simultaneous energy dispersive x-ray spectroscopy and electron backscattered diffraction.
To enable the production of highly polished TEM (transmission electron microscope) lamellas, Zeiss offers an argon ion beam column that can be retrofitted to the NVision 40 CrossBeam workstation. This third column enhances sample quality by almost completely removing surface damage that typically occurs during the initial FIB (focused ion beam) milling steps. The NVision 40 Argon is available in two models: a process-oriented, high-throughput version for preparing routine TEM samples for semiconductor customers and a multipurpose model for processing and analytic applications in materials science and in the semiconductor lab. www.smt.zeiss.com.
Vision and inspection products focus on higher resolution, faster processing
Semicon West, San Francisco, CA, July 15–17, SEMI. www.semiconwest.org.
Qioptic Imaging Solutions showed the compact A-Zoom Micro probing microscope, which streamlines PCB (printed-circuit board), semiconductor, and flat-panel display probing. The company also showed its programmable Fetura advanced-zoom imaging lens that provides zoom magnifications of 0.52X to 6.5X, covers a 12:5:1 zoom range in 500 ms, and includes multiple interfaces for OEM integration.
Aiming at applications that need a portable microscope system, Hirox-USA introduced its KH-7700 system that integrates a digital camera, a light source, a computer, an LCD monitor, and software. The system blends information from multiple exposures to produce a wider dynamic range than can be accomplished with other digital imaging techniques.
Targeting optical inspection and quality control, Leica Microsystems showed several microscopes and macroscopes. The company’s Z16 macroscopes have a 16:1 zoom range and provide zoom magnifications of 0.57X to 9.2X. Leica’s DM6000 automated digital microscope systems can be used with all incident light methods and are designed for use in R&D labs.
FEI debuted the XHR SEMs (extreme high-resolution scanning electron microscopes), which provide subnanometer resolutions and use very low beam energies to avoid distortions caused when the beam penetrates the material underneath the sample (see SEM technology sees below 1 nm). The Magellan 400L model, optimized for semiconductor labs, can view critical details with clarity and contrast on complex 3-D structures in 32-nm nodes and below.
Surface Imaging Systems introduced its NanoStation 300. The system augments atomic force microscopy (AFM) with optical inspection capability to rapidly identify regions of interest. Viscom exhibited its MX100IR desktop system, which uses transmitted and reflected infrared to inspect wafers. Nikon Instruments introduced two new systems. The WES-3000 inspection tool makes it easier to inspect wafer edges, where defects have proliferated and become more complex along with the increased use of immersion lithography. The APM-3000 series leverages a form of birefringence in a Fourier space to detect critical dimension and pattern edge roughness variations in wafers.
Machine Vision Products exhibited its Ultra 850G modular AOI (automated optical inspection) system for packaging and semiconductor inspection, used primarily in flux paste, die placement, component, and underfill processes. Matrox demonstrated the Matrox Imaging Library 9.0, which is tailored for high-throughput, processing-intensive applications such as wafer and mask inspection, and is designed to take advantage of high-performance computing clusters based on graphics processor units.
The new surface-mount device and chip-on-board versions of the high-brightness LED light-line products from Schott Fiber Optics offer high luminosity beams for better contrast in applications such as surface inspection. Schott also showed its new LLS LED light source for machine-vision devices, which runs on less than 15 W and has a 50,000-hr lifetime.
At the InterSolar North America show co-located with Semicon West, KLA-Tencor exhibited its new P-6 surface-profiler system, a bench surface-metrology system for samples up to 150 mm. It applies semiconductor profiler system technology to scientific research and production environments, such as photovoltaic solar cell manufacturing.—Ann R. Thryft
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