Semicon West: Industry takes aim at 22-nm interconnect stack
Ron Wilson, Executive Editor, EDN -- Test & Measurement World, 7/14/2009 5:51:00 PM
| Read more Semicon West coverage |
While much of the industry's attention is focused on the problems of lithography and transistor design at the 22-nm node, another set of issues is quietly stimulating much research, and not a little worry. Researchers are discovering that 22 nm may be beyond the end of the sidewalk for much of the technology we use today to fabricate the interconnect stack on ICs. Things—whether materials choices, processing techniques, or design parameters—will have to change to reach manufacturable 22-nm ICs.
Current work announced at Semicon West (July 14 to 16, San Francisco, CA) by the research consortium IMEC, combined with product announcements made at the end of May by industry giant Applied Materials, illustrate the directions in which investigation is moving. Read the full story on the EDN Website.
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