Electronica: Test, inspection products introduced amid economic uncertainty
Electronica 2008, November 11–14, Munich, Germany, www.electronica.de.
-- Test & Measurement World, 12/1/2008 2:00:00 AM
The attendance for electronica 2008 was remarkably stable despite the difficult financial situation facing many exhibitors and attendees, announced show organizer Messe München International. Messe München added that the trade fair attracted around 2800 exhibitors and around 72,000 attendees—numbers essentially unchanged from the previous electronica show in 2006.
On the show floor, Rohde & Schwarz debuted its FSH4 and FSH8 handheld spectrum analyzers and said it has added microwave models to its FSV family of benchtop signal and spectrum analyzers. Goepel electronic introduced the 9305-BAC/Bluetooth bus access cable—a new member of the ScanFlex boundary-scan product family. Goepel also debuted new SFX/PEC 1149 ScanFlex controllers, its OptiCon X-Line 3D in-line 3-D x-ray inspection system, and, in cooperation with Texas Instruments, VarioTAP emulation technology in the form of a model library for TI's TMS320C2000 platform.
JTAG Technologies introduced the multi-programmable-voltage JT 2149/MPV DIOS (digital I/O scan) module, which allows digital I/O test access to PCBs (printed-circuit boards) requiring external I/O stimulus and response monitoring. The company also said its JT 2147/AGP boundary-scan interface works with Aeroflex ICTs (in-circuit testers). For its part, Aeroflex announced it has added to its PXI Modular Instrument 3000 Series an embedded PXI system controller, 3030 Series GSM/EDGE measurement-suite enhancements, and two new AWG (arbitrary waveform generator) memory options.
Digitaltest debuted its QMAN SQL database, which supports visual inspection and functional test. Aster Technologies highlighted TestWay software, which analyzes electrical testability requirements and estimates test coverage aligned to specific PCB test strategies. Viscom debuted its EasyGen automated-optical-inspection program-generation tool, which can work even with incomplete PCB CAD data. The company also highlighted its S6053BO-V fully automatic wire-bond inspection system, which supports resolutions down to 2 to 5 microns per pixel.
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