News Briefs
Staff -- Test & Measurement World, 12/1/2004 2:00:00 AM
Spectrum analyzers open more views
Tektronix had enhanced its line of real-time spectrum analyzers, introducing a model that provides new ways to view frequency changes in signals over time. The RSA3408A uses color to represent occurrences of a particular frequency, much in the way that the company's digital phosphor oscilloscopes use color to represent occurrences in the time domain.
The photo shows a screen capture from the analyzer. The upper trace shows amplitude as a function of frequency. In the lower trace, brighter colors indicate a greater occurrence of a frequency bin. The third dimension lets you look at a signal's spectrum with respect to time. That's useful for analyzing frequency-hopping signals and signals with complex digital modulation and for looking at occurrences of frequencies in transient signals.
The RSA3408A (base price: $49,800) lets you view time-correlated signals in the time, frequency, and modulation domains for frequencies up to 8 GHz. It also lets you apply a frequency mask with a resolution of 36 MHz to a signal. A continuous-trigger mode lets you look for intermittent signals based on frequency, triggering a capture only when the instrument sees a signal within a preset frequency range. www.tektronix.com.
IEEE amends 802.11 for Japanese market
The well-known IEEE 802.11 standard defines how WLAN equipment should be produced so products from different manufacturers can work together. The IEEE recently amended it to cover new spectra used in Japan. In 2002, Japan approved the use of 4.9-GHz and 5-GHz bands for indoor, outdoor, and mobile uses. IEEE 802.11j, "Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: 4.9—5 GHz Operation in Japan," supports these spectra and their designated applications.
IEEE 802.11j enables WLAN vendors to offer wireless products that adapt to new frequencies, different channel widths, and operating parameters. The amendment allows IEEE 802.11 networks to communicate and move to any new frequency, change the spectrum footprint to improve performance or user capacity, and communicate new rules and operating parameters to support both indoor and outdoor modes. www.ieee802.org.
OpenStar open to all
The Semiconductor Test Consortium (STC) is now selling copies of the hardware and software specifications for the Open Semiconductor Test Architecture (OpenStar) to the public. Previously, the standard was available only to STC members.
Through the OpenStar platform, the STC hopes to encourage the development of open-architecture test products that offer hardware and software interoperability. According to the STC, the platform is supported by 32 semiconductor, equipment, and instrumentation companies. Copies of the hardware and software specs are sold separately at a cost of $250 each. www.semitest.org.
Funding round nets Inphi $18 million
Inphi, a developer of precision timing devices and high-speed electronic components, has announced that it secured $18 million in investments during a recent funding round. The funding came from several existing investors plus one new investor: Cadence Design Systems. Inphi expects to use the funding to expand production of its DDR2 logic devices as well as to launch its Advanced Memory Buffer (AMB) in early 2005. www.inphi-corp.com.
Agilent and Synopsys cooperate on scan diagnostics
Agilent Technologies and Synopsys have announced a scan diagnostics reference methodology that the companies claim will speed up fault localization and failure analysis on semiconductors. Resulting from a three-year strategic alliance, the new methodology makes use of the Synopsys TetraMAX automatic test pattern generator along with the Agilent 93000 SOC series tester and 93000 SmarTest Program Generator 2.2. The companies say that the combined tools automate the sharing of information between electronic design automation (EDA) tools and automatic test equipment (ATE).
"Our customers want us to link design and test more closely in order to lower the overall cost of test," said Tom Newsom, VP and general manager of Agilent's SOC Business Unit, in a prepared statement. "Our strategic
alliance with Synopsys has successfully contributed toward bridging the gap between EDA and ATE." www.agilent.com.
KYEC purchases multiple Teradyne interfaces
Teradyne has reported that King Yuan Electronics Co. (KYEC), a Taiwan-based IC test house, has purchased multiple Handler Interface Board (HIB) Changers for use on its installed base of Teradyne Flex test systems (pictured). The HIB Changer is a mechanical interface between the handler and test system that reduces operator setup time, thus improving efficiency when a system must be changed over to test a new device type.
Kim Abplanalp, a product manager in Teradyne's Production Integration group, released a prepared statement, saying, "The key is to minimize test cell changeover time between production runs. Our innovative approach reduces the HIB change from a 15-minute operation requiring two people to a one-person process completed in less than five minutes." www.teradyne.com.
Calendar
APEX, February 22–24, Anaheim, CA. Part of the Electronic Circuits World Convention, APEX focuses on electronics assembly processes and equipment. Sponsored by IPC. www.goapex.org.
Burn-in and Test Socket Workshop, March 6–9, Mesa, AZ. A forum for information about the socket industry. Sponsored by IEEE Computer Society, Test Technology Technical Council. www.bitsworkshop.org.
Optical Fiber Communication (OFC) Conference & Exposition and the National Fiber Optic Engineers Conference (NFOEC), March 6–11, Anaheim, CA. OFC/NFOEC 2005 will cover optical technology—-both in terms of research breakthroughs and commercial products and services. Sponsored by Optical Society of America, IEEE, and Telcordia. www.nfoec.org.
IEEE Wireless Communications and Networking Conference (WCNC), March 13–17, New Orleans, LA. Tutorials, research, and industry-oriented technical content on terrestrial wireless communication in all forms. Sponsored by IEEE. www.wcnc.org.
IEEE Wireless and Microwave Technology Conference: WAMICON 2005, April 7–8, Clearwater, FL. Topics will include 3G/4G wireless communications and 802.11/HyperLAN2 wireless LAN systems. Sponsored by IEEE. www.wamicon.org.
Wescon, April 12–14, Santa Clara, CA. The conference program provides application solutions for design problems and emerging technologies. Sponsored by IEEE. www.wescon.com .
NEPCON East/Electro and Assembly East, May 3–5, Boston, MA. These co-located shows for electronics manufacturers cover the electronics assembly process. Sponsored by Reed Exhibitions, IEEE, EIA, and Assembly magazine. www.nepconeast.com.
The Vision Show West, May 17–19, San Jose, CA. A technical conference and exhibit covering machine-vision components, systems, and solutions. Sponsored by Automated Imaging Association. www.machinevisiononline.org.
To learn about other conferences, courses, and calls for papers, visitwww.tmworld.com/events.
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