Machine Vision and Inspection at Productronica
-- Test & Measurement World, 11/20/2005 7:45:00 PM
Machine-vision and inspection products at Productronica (Munich, Germany, November 15-18, www.productronica.de) ranged from Leica microscopes to automated x-ray systems from VJ Electronix. Exhibitors of other machine-vision and inspection products included Lloyd Doyle, MVP, Omron, ViTechnology, Viscom, and X-Tek.
Viscom (www.viscom.de) debuted its S6056 automated optical inspection system for printed-circuit boards. Building on the company's S6055, the new system adds a double-track capability to provide for parallel inspection of two PCBs.
Lloyd Doyle (www.lloyd-doyle.com) announced the European release of its LD6000 range of automated optical test equipment for detecting faults during PCB manufacture. The system handles all contemporary flexible and rigid multilayer PCB laminate configurations, including high-Tg laminates for microwave applications. It employs CCD camera technology and FPGA-based electronics. The company also announced its new IBIS (Interferometric Bump Inspection System) micro solder-bump inspection system, which can scan 3000 devices per hour and report solder-bump height, volume, circularity, and coplanarity.
Omron Electronics Europe (www.eu.omron.com) launched its VT-RNS-ptH desktop AOI system, which employs the company's color highlight technology. The VT-RNS-ptH will complement Omron’s VT-RNS range by employing identical inspection algorithms. The company also announced a prelaunch edition of its Q-upNavi process-improvement software, which works with the VT-RNS lineup. The software analyzes data gathered at each production stage in real time to help predict defect causes and to recommend countermeasures.
MVP (www.machinevisionproducts.com) displayed its high-speed AutoInspector Ultra II wire-bond inspection system, which checks for wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination. The company also displayed its tabletop GEM Series system with its newly released version 5.0 software, which includes a newly redesigned graphical interface for quick algorithm set-up and guidance in setting parameters.
VJ Electronix (www.vjelectronix.com) exhibited its Model 1550 automated x-ray inspection system, which combines large-board (18 x 24-in.) inspection with automated motion control, measurement, and analysis. Additional characteristics include solid-state detector-based inspection for lead-free assembly, a choice of image intensifiers and CMOS-based image detectors, full programmability with integrated motion control and image measurement analysis, and simple program setup.
The company also demonstrated its Summit 1800, a new rework system that addresses lead-free rework for large components; a 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets, and connectors. The firm also displayed its X130D x-ray inspection system for failure analysis.
Leica Microsystems (www.leica.de) highlighted its new DM2500 M for inspecting circuit-board cross sections; the instrument, which features color-coded field and aperture diaphragm adjustment capability, allows simpler, more intuitive handling. The company also described its StereoExplorer for calculating and visualizing 3-D surfaces at the microscopic level; its IC D for image display, processing, archiving, analysis, presentation, or printing; its Z16 APO zoom system for the precision measurement of distances; and its roller-bearing swing-arm stand, which is compatible with all Leica stereomicroscopes and macroscopes.
ViTechnology (www.vitechnology.com) demonstrated five of its Vi-3K AOI systems operating using different hardware and software configurations that adapt the systems for use at various stages of the printed-circuit-board assembly line. The company also demonstrated its Vi-5000 AOI system, which features a 10-micron accuracy at 6-sigma levels with a repeatability of plus or minus 2 microns.
X-Tek (www.xtekxray.com) highlighted its new Revolution real-time microfocus x-ray system, which offers viewing angles of up to 75 degrees (15 degrees relative to the plane of a board under inspection). The system allows for magnification up to 6000 times at all angles over the entire 406x406-mm inspection area. The system allows for quick analysis of BGA ball wetting, attachment, cracks, and delamination.
Phoenix|x-ray (www.phoenix-xray.com) chose Productronica 2005 as the venue for debuting its microme|x x-ray system for inspection of printed-circuit-board assemblies.
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