APEX highlights test and inspection suites and systems
-- Test & Measurement World, 4/7/2009 11:40:00 AM
The IPC APEX Expo, held March 31-April 2, 2009, in Las Vegas, gave exhibitors the opportunity to present boundary-scan tools, vectorless test capabilities, software suites, optical and x-ray inspection systems, and functional, flying-probe, and in-circuit testers.
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Industry experts discuss the future of test at APEX’s Test and Inspection Summit |
Agilent Technologies (www.agilent.com) highlighted its strategic partnership with ASTER Technologies (www.aster-technologies.com) to enable integration of ASTER’s TestWay Coverage Analyst (TCA) across Agilent’s printed-circuit-board assembly-test platforms. The TestWay Coverage Analyst provides a pushbutton test coverage analysis tool for coverage estimation (pre-test program development) and coverage measurement (post-test program measurement) using
analysis for the Agilent Medalist i3070 & i1000 platforms and various other test and inspection equipment on the user’s production line, such as optical and x-ray inspection, boundary-scan test, and functional test.
The tool is able to objectively calculate the theoretical coverage from early in the product development cycle using CAD files; it measures the real coverage from the developed test programs.
Agilent also highlighted its Super 7 suite, which comprises the company’s boundary-scan and other tools that maximize test coverage despite limited access. Suite 7 includes Agilent’s Cover-Extend technology, which received an EDN Innovation award March 30 and a Test & Measurement World Best in Test award April 1.
Seica (www.seica.com) demonstrated its Pilot V8—the latest addition to its line of flying-probe test systems. The Pilot V8's vertical architecture enables high speed, high precision probing on both sides of the UUT simultaneously to maximize test coverage. It comes equipped with eight electrical flying test probes (four on each side), two Openfix capacitive probes, two power flying probes, and two CCD cameras (one on each side). Seica also demonstrated its Strategy in-circuit/functional tester for consumer and automotive applications. The Strategy supports tests including traditional in-circuit test (with up to 8192 test pins); vectorless test, low-voltage, low-power analog functional test; and high-frequency digital functional test, with diagnostics guided by a mathematical simulator.
Goepel electronic (www.goepel.com) announced the launch of a new automatic test-program generator (ATPG) for true hierarchical test at the board level based on the company’s System Cascon boundary-scan software platform. The newly developed tool automates the generation of board-centric boundary scan tests based on library models of conventional components. The company also launched the TIC02/LV TAP interface cards (TIC). These new members of the company’s ScanFlex boundary-scan hardware platform were specially designed for low-voltage and ultra-low-voltage applications; they support GTL (Gunning transceiver logic) interfaces.
Aegis Software (www.aiscorp.com) unveiled the third major release of its Version 7 Manufacturing Operations Software, known as R3. R3 incorporates hundreds of customer-driven enhancements, which support process planning, paperless delivery, product tracking, quality collection and repair, dashboards, and analytics. In particular, R3 adds a fully redesigned shop-floor materials-control interface.
Teradyne (www.teradyne.com) demonstrated its new Powered Framescan vectorless test tools at the booth of its partner TEAM A.T.E. (www.team-ate.com). Powered Framescan combines boundary scan and vectorless test technologies to detect faulty pins on connector and device pins that do not have test point access. CyberOptics (www.cyberoptics.com) featured its SE 300 Ultra 3-D solder paste inspection system. New capabilities include a feature-level mode for defect review and pass/fail classification. The company also highlighted its Flex HR is an enhanced resolution AOI system. VJ Electronix (www.vjelectronix.com) unveiled the newly expanded 400 Series benchtop rework platform capable of addressing challenging lead-free rework applications. The company also highlighted its Vertex Series-A x-ray inspection system for high-speed pre- and post-reflow inspection applications. RMD Instruments (www.rmd-leadtracer.com) highlighted its LeadTracer-RoHS system, debuting a new solder analysis and identification feature that can help identify counterfeit or substandard components. Everett Charles Technologies (www.ectinfo.com) Contact Products Group demonstrated its new ZIP two-dimensional low-cost spring contacts.
See related article, “Industry experts discuss the future of test at APEX’s Test and Inspection Summit.”
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