Sonoscan performs effective acoustic imaging of stacked die
-- Test & Measurement World, 8/19/2009 9:00:00 AM
Sonoscan has announced that its SonoLab Division now offers a new service that it claims provides greatly enhanced acoustic microscope imaging of stacked-die assemblies. The service, available immediately, employs Sonoscan's proprietary software to image die stacks with high accuracy for internal defect analysis.
Most significantly, it can assign a defect or other feature to a specific layer within the stack, a capability that had been limited due to the thinness and number of layers. "The merging of the new software with Sonoscan's C-SAM hardware means that we can now effectively and consistently image the multiple layers in stacked-die configurations," said Ray Thomas, SonoLab manager. "In the hands of our experienced applications engineers, this software provides accurate and reliable analyses of stacked die."
The analytical service is being offered to IC designers, IC packaging engineers, semiconductor failure analysis labs, and semiconductor manufacturing engineers.
Sonoscan, www.sonoscan.com.
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