Aries adds new CSP test socket
-- Test & Measurement World, 10/1/2009 2:00:00 AM
With the introduction of a socket that accommodates devices 13 mm² or smaller with a pitch of 0.30 mm or higher, Aries Electronics has expanded its line of CSP (chip-scale package) and MicroBGA (ball-grid array) test and burn-in sockets that have an optional adjustable pressure pad. The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
The new CSP socket incorporates a simplified pressure-pad compression design for a greater range of movement without overcompressing fragile devices. Users can adjust the pressure pad on the new socket with the lid open or closed simply by using the included hex key; the socket can adapt to device thickness variations up to 1 mm. Greater ranges can be custom-designed per application. The ability to adjust the compression force on the device enables the operator to fine-tune the pressure pad force, which is helpful when trying to overcome coplanarity issues with the device or test board.
With a signal path of 0.077 in. (1.96 mm), the new socket provides minimal signal loss for higher bandwidth capability. The socket is easily mounted to and removed from the burn-in board. Contact forces are 15 g per contact on a 0.30-mm to 0.35-mm pitch, 16 g per contact on a 0.40-mm to 0.45-mm pitch, and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is –55°C to +150°C, and estimated contact life is a minimum of 500,000 cycles.
Base price: $200 for a typical BGA device with 64 leads on 0.8-mm pitch. Aries Electronics, www.arieselec.com.
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