SemiProbe wafer-inspection system detects macro defects
-- Test & Measurement World, 1/5/2010 12:12:00 PM
Microelectronic device manufacturers can use the IRIS wafer-inspection system from SemiProbe to detect flaws in the wafer circuit pattern, as well as contamination or process damage. Depending on the choice of optics, the IRIS inspection system is able to identify defects as small as 3 µm.
The system is well suited for examining optical components, double-sided devices, photovoltaics, MEMS, and other microelectronic devices. IRIS can find a variety of visual defects, including probe marks, ink dots, residual films, thru-silicon vias, bumps, saw, pattern, incomplete etch, resist, scratches, cracks, chips, large-scale contamination, and passivation. Configurations are available for performing manual visual inspection on a semiautomatic stage or automated inspection using PILOT pattern-recognition software.
Once a defect is identified, its failure code is noted on the wafer map. The system's wafer-mapping tool allows graphical and data analysis of the wafer inspection, both during and after the scan. Wafer maps are fully exportable in a variety of formats for offline analysis or downstream processing. In addition to various optics packages, IRIS offers such options as inking, vibration isolation, and a status signal tower.
SemiProbe, www.semiprobe.com.
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