Goepel and Rohde bring JTAG into TSVP platform

The integrated R&S Test System Versatile Platform contains a Scanflex PXI JTAG controller as well as PXI 5296 and PXI 52192 digital I/O modules.

Colin Holland, EE Times -- Test & Measurement World, 11/16/2011 11:41:20 AM

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PRODUCTRONICA 2011, MUNICH - Goepel Electronic has worked with Rohde & Schwarz to develop an extended boundary-scan option for the R&S TSVP (Test System Versatile Platform). The solution is based on PXI components, involving the peripheral signal of the UUT (unit under test).

The R&S TSVP allows the execution of in-circuit tests and functional tests. Along with a Goepel Scanflex PXI JTAG controller, the integrated boundary-scan option contains Goepel's PXI 5296 and PXI 52192 digital I/O modules, which have 96 and 192 channels, respectively.

These digital test channels are linked with the Virtual ScanPin technology, so that the contacted test point acts as additional, virtual boundary-scan cells during the test process. Detection of certain faults is possible only by the interaction of both methods.

The fully automatic boundary-scan test generation is implemented based on CAD data and R&S TSVP data for the description of test points and their wiring. The integrated fault report displays faults of both the in-circuit and boundary-scan tests in the output window of the R&S TSVP. The option allows the configuration of PLD/FPGA components, loading of flash components and programming of microcontrollers.

Goepel Electronic’s System Cascon JTAG/boundary-scan software supports the system integration. With the software's application programming interface, the entire function library can be integrated into the R&S TSVP. Goepel provides an integration package at various levels, differing in hardware performance and software options. Each integration package contains a Scanflex  SFX/PXI1149/C4-FXT controller with differential signal transfer and TIC-02/SR modules to be built into the test fixture. The Scanflex platform enables an optimized signal quality for test frequencies up to 80 MHz. Furthermore, extended integration packages also contain Goepel Electronic’s PXI digital I/O modules.

Part of each package is the Cascon-for-R&S TSVP installation. This is a kit consisting of software, demonstration reference board, and a one-year maintenance contract for both software and hardware.

Goepel Electronic, www.goepel.com
Rohde & Schwarz, www.rohde-schwarz.com

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This story was originally posted by EE Times.

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