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Smart cameras inspect dense interconnect sockets

Rick Nelson, Executive Editor -- Test & Measurement World, 4/1/2003

An IBM iSeries Model 890 high-end server requires up to four interposers—flexible array interconnect sockets that mount single-chip-module components onto multilayer PCBs (Figure 1). The interposers measure 36x36 mm, exhibit nonuniform backgrounds, and vary in size, shape, and color. Some have 4000 contacts measuring less than 1 mm in diameter and spaced 1 mm apart.

Figure 1 A 36X36-mm interposer can have 4000 contacts spaced 1 mm apart. Courtesy of IBM.

Brian Kreifels, industrial engineer at IBM (Rochester, MN; www.ibm.com), says that the company traditionally inspected these interposers with a costly manual process that yielded inconsistent results. Seeking an alternative, IBM employed a Model 542C SmartImage machine-vision sensor from DVT (Norcross, GA; www.dvtsensors.com) to detect multiple flaws, such as shorts and contamination defects, during an inspection process that required less than five minutes per module.

The Model 542C forms the heart of a system that also includes a robot and controller from Intelligent Actuator (Torrance, CA; www.intelligentactuator.com). For IBM's application, the 542C's color-matching tool distinguishes gold wire from a black background, enabling detection of single-wire faults that black-and-white cameras can't identify.

Figure 2 A robotically positioned color vision sensor inspects componenets under test and logs data over an Ethernet link. Courtesy of IBM.

Michael Williams, senior technical writer at DVT, explains that a built-in microprocessor along with built-in Ethernet connectivity enable the SmartImage to operate without external computers. With support from DVT's local distributor, IBM used DVT's Windows-based machine-vision software, Framework, to develop a user interface to view inspection images, manage passwords, and log inspection data and part serial numbers to Microsoft Excel. IBM's Kreifels says that the system paid for itself in six weeks.

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