Tour the new Test & Measurement World
Lawrence D. Maloney, Editorial Director -- Test & Measurement World, 4/1/2003
If you did a double take when this April issue hit your desk, rest assured that you are indeed reading Test & Measurement World. But we are offering you a new look and a revamped editorial package that we believe is more in tune with busy engineers who must stay on top of the fast-moving world of technology.
While our old format focused primarily on tutorial articles, our new editorial mission gives you a blend of "what's new" and "how to." We know from our reader research that work burdens can severely limit your reading time. Meanwhile, you have grown used to getting more of your information on the Web, which serves up fast, easy-to-access technical data to help you meet on-the-job challenges.
The front section of our redesigned magazine, we hope, answers your need to get information quickly and easily. Trade show highlights and short news items offer brief bulletins on the latest developments in the test and measurement field, with reference to Web sites for more details. Then, in a series of one-page "Tech Trends" articles, our engineer-editors analyze important trends in vital areas of interest to our readers: bench-level test, semiconductor test, manufacturing test, and machine vision. Read those pages, and you'll get a solid feel for what is really significant in the world of test.
Also found in the magazine's up-front section: "Test Digest" stories featuring applications, mini-tutorials, book reviews, and the like—with references to the Web for more on the topic. In each issue, too, we'll give you a glimpse of how your fellow engineers met and overcame technical obstacles in our "Project Profile" page.
The cover of this issue—and those of most T&MW issues you'll read this year—will be devoted to an "On the Road" feature. Here, our editors visit an engineering team for a close-up look at the strategies and test tools used to solve problems in design verification and manufacturing. A strong desire for these "lessons learned" from successful engineers came through loud and clear in our reader research.
In addition to these new editorial elements, we will continue to give you useful tutorial features on a broad range of technologies, as well as descriptions of the latest new products. Finally, we'll devote our back page to "Viewpoint"—in many issues featuring an exclusive interview with a technical or industry leader.
Bottom line: We want to pack more information than ever into T&MW, while offering a livelier, more visually appealing format. We hope you like the changes and will share your ideas and impressions with our editors.
Contact Lawrence D. Maloney at lmaloney@reedbusiness.com.
