News Briefs
Staff -- Test & Measurement World, 5/1/2003
Tests on the horizon for molecular electronics
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Copyright Robert Rathe. |
The researchers conducted their tests at separate facilities to ensure that the results were not attributable to the test setup. The two groups recorded nearly identical electrical measurements when using the same "crossbar" test structure, consisting of a one-molecule-thick film sandwiched between a series of perpendicular metal wires. The measurements confirmed that the molecular electronic device functioned as a switch, alternating between different currents in response to different input voltages. NIST physicist Curt Richter (shown in photo) attributes the switch-like behavior to interaction at the interface between the molecular monolayer and the wire electrodes. www.nist.gov/public_affairs/richter.pdf.
Test Product of the Year announced
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Fluke's Peter Dack (left) accepts the Test Product of the Year Award from Rick Nelson. |
In announcing the 8508A as the Test Product of the Year, Larry Maloney, T&MW's VP and editorial director, explained that the Fluke multimeter is a winner with readers because "you can calibrate every function in a multifunction calibrator in one single box." Peter Dack, Fluke's business development manager, accepted the award on his company's behalf.
Maloney also presented plaques to the 12 companies who were recipients of the 2003 Best in Test Awards:
- Vectron, K2-AOI automated optical inspection system
- Inovys, Ocelot DFT-focused IC testers
- LeCroy, WaveMaster 8600A oscilloscope National Instruments, PXI-5660 RF signal analyzer Yokogawa, DL 750 Scopecorder oscilloscope OriginLab, OriginPro 7.0 data-analysis and plotting software
- IFR, 3410 Series digital RF signal generators NPTest, IDS OptiFIB focused-ion-beam system Synopsis, SoCBIST design-for-test software Teradyne, Integra FLEX semiconductor test system
- Agilent Technologies, 81250 ParBERT parallel bit-error-ratio tester
- Fluke, 8508A reference multimeter
T&MW editors have presented the Best in Test Awards every year since 1991. www.tmworld.com/bit.
(Publisher's note: Readers can view advertisements featuring award-winning technologies in this issue. Look for the "Best in Test" logo on the ads.)
LSI Logic overcomes quality barriers
LSI Logic (Milpitas, CA) has released its Statistical Post-Processing test methodology for defect screening on deep-submicron, system-on-chip (SOC) designs. The company has applied the methodology, which it developed in collaboration with Portland State University, to its ASIC production line for 0.18-mm and 0.11-mm process technologies.
Demonstrating a 30% to 60% decrease in failure rate measured by defects-per-million (DPM) units and early-failure-rate (EFR) values, this defect-screening approach is especially suited to applications in the communications and storage markets, according to Lucas Tsai, senior marketing manager of the company's Advanced Silicon Products division.
The testing methodology identifies unusual data values or statistical "outliers" by using raw data from ATE and wafer-sort maps. Post-processing modules for major defect categories estimate and factor out the defect-free contributions so the defects can be identified and screened. This level of defect screening efficiency cannot be achieved with traditional on-tester methods or burn-in. www.lsilogic.com.
Iowa State receives Teradyne tester
Teradyne (Boston, MA) has announced plans to donate an Integra J750 semiconductor test system and other services valued at more than $500,000 to Iowa State University's College of Engineering. The J750, which automates testing procedures that can take hundreds or thousands of hours, should help students and faculty perform advanced research and faster testing of semiconductor chips.
In a prepared statement, Mike Bradley, president of Teradyne's Semiconductor Test Division, said, "This J750 donation will help both ISU students, who will get an opportunity to work on the latest test technology, and companies like Teradyne, who will have a deeper pool of technical talent to recruit from." www.teradyne.com.
IEEE 802 standards gain enhancements
The IEEE has begun work on two additions to the IEEE 802 family of networking standards. IEEE P802.3ak, "Physical Layer and Management Parameters for 10 Gb/s Operation, Type 10GBASE-CX4," will allow for a copper physical medium in conjunction with the IEEE 802.3ae 10-Gbits/s Ethernet standard. It will provide a lower-cost option for interconnecting pieces of equipment located within about 15 m of each other, typically within a stack or in adjacent racks.
IEEE P1802.16.3, "Radio Conformance Tests (RCT) for 10–66 GHz WirelessMAN-SC Air Interface," will specify the tests needed to ensure conformance at the radio interface for base stations and subscriber stations in IEEE 802.16 broadband wireless area networks. www.standards.ieee.org.
Economic outlook
DSLAM market: High-tech market-research firm In-Stat/MDR has reported that the market for Digital Subscriber Line Access Multiplexers (DSLAMs) held steady in terms of volume of ports shipped in 2002, but that the growth rate in DSLAM port shipments will decline over time and become negative by 2006. www.instat.com.
Source:
In-Stat/MDR.
Chipset forecast:
In-Stat/MDR also says that 2002 was a great year for manufacturers of wireless LAN components, with sales of wireless LAN chipsets growing strongly over 2001. For 2003, the company predicts that the number of chipsets to be sold will exceed 33 million, and by 2007, the number of wireless LAN chipsets is forecast to be over 94 million. www.instat.com.
Component orders: The Electronic Components, Assemblies & Materials Assn. has reported that component orders remained flat in Q1 2003. In its monthly index released in early April, the ECA says most companies are trying to balance capacity with demand, which could lead to spot shortages for some components. www.ec-central.org.
Calendar
Supercomm, June 1–5, Atlanta. Topics include communications and information technology. Sponsored by Telecommunications Industry Association and United States Telecom Association. 301-694-5243; www.supercomm2003.com .
Design Automation Conference (DAC), June 2–6, Anaheim, CA. Topics include design methodologies and electronic design automation (EDA) tool developments. 303-530-4562; www.dac.com .
International Robots & Vision Show, June 3–5, Rosemont, IL. Topics include improving product quality and lowering manufacturing costs. Sponsored by Automated Imaging Association. www.robots-vision-show.info .
International Microwave Symposium, June 8–13, Philadelphia. Topics include modeling, simulation, and measurement techniques. Sponsored by IEEE Microwave Theory and Techniques Society (MTT-S). www.ims2003.org .
NEPCON East 2003/Assembly East, June 10–11, Boston. These co-located shows cover electronics manufacturing and components. Sponsored by Reed Exhibition Cos. 800-467-5656; www.nepcon.com .
Semicon West, July 14–18. The show will be split into two parts: wafer processing—July 14–16 in San Francisco; final manufacturing (including test)—July 16–18 in San Jose. Sponsored by SEMI. 408-943-6901; www.semicon.org .
EMC Symposium, August 18–22, Boston. Sponsored by IEEE, EMC Society. 732-562-3870; www.emc2003.org .
To learn about other conferences, courses, and calls for papers, go to www.tmworld.com/events.
