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Testing outside the box

Steve Scheiber, Contributing Technical Editor -- Test & Measurement World, 5/1/2003

The greatest challenge to those of us involved in electronics manufacturing and test has not changed in decades. Our job is to get products out the door so they work when they reach customers. As always, however, the pace of product development outstrips tester advancement. The solution lies in taking a more "top-down" approach, developing an effective overall test strategy that detects every possible fault type without looking for every fault at every step. Such a strategy increasingly includes steps that lie outside the traditionally narrow definition of "test." Many companies regard inspection as part of the manufacturing operation, rather than as a test activity. As optical, infrared, and x-ray inspection continue to supplement more conventional test approaches, however, maintaining such divisions becomes counterproductive.

Fortunately, dawn is breaking. Agilent Technologies' (www.agilent.com) promotion of the concept of "intelligent test" and Teradyne's (www.teradyne.com) Design-to-Build and other software products address these issues directly.

Opens and shorts represent faults that an inspection step can find, eliminating the need to look for them again at subsequent electrical-test steps. Courtesy of Teradyne.

Agilent's AwareTest xi, for example, allows 5DX x-ray-inspection and 3070 in-circuit test systems to communicate and collaborate, sharing CAD and test information so that during test development each system "knows" whether the other is already testing for a particular fault. Agilent's TestWise SPC software enables companies to more easily implement statistical process control.

Eliminating faults at the process level improves first-pass yields, thereby lowering overall manufacturing costs. It also reduces the throughput burden on test operations, since there is no need to look for those same faults downstream.

Similarly, Teradyne's Design-to-Build (D2B) software provides a modular environment that streamlines the flow of product information throughout the design-to-manufacturing cycle. It eliminates unnecessary data transfer and data manipulation steps and allows customers to develop comprehensive "test" strategies on a PC.

D2B also offers distributed test-management across a company's entire range of test and inspection platforms. Again, the goal is to allow OEMs and CMs alike to reduce the cost of manufacturing and test development and to permit companies to bring products to market more quickly.

These two ATE giants are by no means alone. In every corner of the industry, companies are linking manufacturing, inspection, and test into a coherent unit. Manufacturers that do not make equipment for all test and inspection steps themselves are forming alliances to gain access to complementary capabilities.

The customers reap the benefits. Let the harvesting begin!

Steve Scheiber, Contributing Technical Editor, sscheiber@aol.com

 

YesTech makes its debut

YesTech (San Clemente, CA), a manufacturer of x-ray and optical inspection equipment, announced its launch during Apex (March 31–April 2, Anaheim, CA). The first optical offering is the $80,000 YTV-1000 inline automated-optical-inspection system, which can inspect boards as large as 20x24 in. The x-ray entry is the $85,000 YTX-3000, which can inspect BGA and flip-chip components on PCBs. www.yestechinc.com.

Samsung automates cell-phone testing

An application note describes how Samsung automated three manual RF tests on its cell-phone manufacturing line. The company used National Instruments' LabView graphical programming environment and TestStand test executive to automate the tests. The new approach reduced test time while increasing test reliability; three tests that had been performed by three workers are now performed sequentially on a single system. www.ni.com.

ITC woos PCB test engineers

It's not too late to make your voice heard at this year's International Test Conference (September 30–October 2, Charlotte, NC). To encourage participation from the board and system test community, organizers of the chip-centric show have extended to June 6 the submission deadline for papers on topics ranging from in-circuit test to emerging standards such as IEEE P1581 Static Component Interconnection Test Technology (SCITT). www.itctestweek.org.

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