Global TMW:
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Open architecture supports parallel test

Rochit Rajsuman, Advantest America R&D Center, Santa Clara, CA -- Test & Measurement World, 12/1/2003

As the transistor geometry shrinks, more transistors are packed on to a single chip, reducing manufacturing cost on a per-transistor basis. The result, however, is more transistors to test; hence, test cost increases on a per-chip basis for SOC and other logic devices.

Falling commodity DRAM test costs per site suggest a method for controlling logic test costs per chip. Numbers are based on an Advantest T55XX Series tester.

DRAM and flash-memory manufacturing suggests a way to control these increasing test costs per chip. Historically, DRAM capacity (bits per chip) has roughly followed Moore's Law. DRAM capacity has quadrupled every three years, and the cost per bit has gone down in the same proportion, from above 60 microcents/bit for 64 Mbits to under 3.8 microcents/bit for 1 Gbit.

Yet, despite the increasing densities, per-chip test costs for commodity memories have actually fallen. DRAM per-site cost (tester + handler) was approximately $400k at the end of 1997; today, per-site cost is approximately $27k (figure). Because of such reduction, memory test cost is a non-issue—test cost discussions focus on SOCs and microprocessors.

Test-system vendors employ massive parallelism to control memory test costs. In 1997, 32 DUTs were tested in parallel; today, 128 DUTs are tested in parallel, increasing throughput from 3000 devices/hr to over 12,000 devices/hr, achieving test productivity of about 1 Gbit/s.

For SOCs and microprocessors (logic test), design-for-testability (DFT) and built-in self-test (BIST) have distracted IC manufacturers. DFT and BIST shift costs from the test floor to the design engineer, but it is arguable if they reduce the overall cost. Lessons from memory test dictate that parallel test is a good way to control the test cost on a per-chip basis. The recent Open Architecture Initiative, including the efforts of the Semiconductor Test Consortium (www.semitest.org), incorporates this key lesson in a basic feature set of the open-architecture test system. To learn how the emerging open architecture addresses parallel test for SOCs and other logic devices, you can read my paper "Why Open Architecture Tester Should Support Parallel Test" at www.tmworld.com/parallel.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

There are no other articles written by this author.

Sponsored Links



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts

Blogs

  • Rick Nelson
    Taking the Measure

    June 25, 2008
    CEOs address proposed Credence, LTX integration
    Credence and LTX complement each other with respect to customers, product lines, facilities, and emp...
    More
  • Rick Nelson
    Taking the Measure

    June 23, 2008
    Credence, LTX plan merger, rationalization ahead
    Credence and LTX yesterday announced plans to merge (see related story), leading to product-line rat...
    More
  • » VIEW ALL BLOGS RSS

Podcasts

Advertisements





NEWSLETTERS

Click on a title below to learn more.

Test Industry News (3 Times Per Month)
Machine-Vision & Inspection (Monthly)
Communications Test (Monthly)
Design, Test & Yield (Monthly)
Automotive, Aerospace & Defense (Monthly)
Instrumentation (Monthly)
Resource Center E-Alert (Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites