1.00-mm BGA sockets
Staff -- Test & Measurement World, 6/1/2004
Molded from high-temperature thermoplastic, these 1.00-mm pitch BGA sockets offer improved hole-to-hole accuracy, reduced insertion and withdrawal forces, and coplanarity within 0.006 in. (0.15 mm). The full grid wafers are pin-loaded to the exact footprint specified and are available in any footprint pattern up to 2626 rows to accommodate BGA, LGA, or CSP devices as large as 27 mm square. Options include custom terminal designs, polyimide film seals for automated pick and place, and extraction slots to facilitate device/adapter removal. Advanced Interconnections, W. Warwick, RI. 800-424-9850; www.bgasockets.com.
