Dalsa receives camera development contract
Staff -- Test & Measurement World, 8/1/2004
Dalsa (Waterloo, ON, Canada) announced it has received a $1.6 million camera development contract from a leading manufacturer of semiconductor wafer-inspection systems. The project will be completed over the next 15 months at which time the product will be available for significant follow-on production for the customer.
Under the terms of the contract, Dalsa will develop high-performance digital cameras that will be used to inspect semiconductor wafers at high speeds and low light levels. The cameras will be the electronic eyes in the customer's next-generation of inspection systems, enabling semiconductor wafer manufacturers to maintain better quality control, improve yield, and lower costs. www.dalsa.com.
