Inspection system handles CSPs, BGAs
Staff -- Test & Measurement World, 9/1/2004
The Octaveo Model 50CSP 3-D package-inspection system targets chip-scale packages (CSPs) and ball-grid arrays (BGAs). It combines pattern recognition, precision metrology, and topographical analysis, providing automatic detection of missing, deformed, or misaligned solder balls. Test engineers can use the system's scripting environment to customize production-mode sequences for different sizes and styles of chips and for binning.
The Model 50CSP includes a 1.3-Mpixel on-axis camera and adjustable optics that can inspect solder balls ranging from 0.1 mm to 0.4 mm in diameter on chips varying from 1 mm to 7 mm on a side. System software can handle arrays up to 30x30 balls. With the scripting environment, users can measure and sort single chips or arrays of chips according to diameter, curvature, shape quality, and grid location. The system's enclosure houses the camera, LED illuminators, and control electronics. It includes a 3-GHz Pentium 4 embedded PC to process chips at rates of 5 to 10 parts/s.
Base price: $15,000. Logos Systems International, Scotts Valley, CA. www.logosvisionsystem.com .
