Die marking system
Staff -- Test & Measurement World, 11/1/2004
A fully automated backside die marking system, the WaferMark CSP200 uses laser technology to mark orientation and traceability information on each die on silicon wafers up to 200 mm. Highly accurate, the system is capable of marking die as small as 0.5 mm in size on a variety of wafer surface types. Integrated mark inspection capability verifies the accuracy and quality of all marked die. GSI Lumonics, Northville, MI; www.gsilumonics.com.
