Laser fuse processing platform
Staff -- Test & Measurement World, 2/1/2005
WaferRepair systems not only address the requirements of laser fuse processing of high-density DRAM and other memory devices using redundancy, but also permit laser programming for device customization and repair. The platform delivers the overall system precision required by 90-nm and smaller design rules by implementing refinements in beam placement accuracy, laser spot size, and ultra-fine, ultra-stable energy control. The WaferRepair M450 has a laser spot size of 1.4 µm, while the M455 has a laser spot size of 0.7 µm, enabling aggressive fuse pitch shrinks below 2 µm. Both systems process fuses at a rate of 60,000 Hz with beam positioning accuracy of ±0.150 µm.
GSI Lumonics, Northville, MI; www.gsilumonics.
