AOI system
Staff -- Test & Measurement World, 5/1/2005
To verify the adhesive integrity of bond connections on SMD assemblies and to identify deficient wires in multiple bonds, Viscom AG has introduced the S6053BO automated optical inspection system. During inspection, the system scans all bond positions and bond leads with high-resolution cameras and evaluates them with the assistance of Viscom's inspection software. The system inspects ball bonds, leads, wedge bonds, the die itself, and the position of the components, and it can inspect heavy-gauge aluminum as well as light-gauge aluminum and gold leads in a single pass. The S6053BO can also check for the emergence of conductive adhesive beneath dies and recognize scratches and eruptions on die surfaces. Viscom, www.viscom.de.
