No-lead SMD removal kit
Staff -- Test & Measurement World, 5/1/2005
The Chip Quik lead-free surface-mount-device removal kit is designed to assist engineers and technicians conducting SMT rework. The Chip Quik removal method requires no expensive removal equipment, encouraging easy removal of QFPs, PLCCs, SOICs, and other SMD chip components at safe, low temperatures (less than 300°F) using a standard soldering iron.
A user applies the kit's rework flux to all leads of the device to be removed and uses a standard soldering iron to melt the no-lead Chip Quik removal alloy. The flux and alloy react with the existing solder to create and maintain a molten state. Once this state is achieved, a user can remove the SMT device using precision tweezers or a vacuum pen, which are provided in the kit along with cleaning wipes, liquid flux remover, and swabs to assist users in cleaning the printed-circuit board.
Base price: $150 for a kit with sufficient materials to remove 12 to 15 SMDs. Emulation Technology, www.1800adapter.com.
