Show Highlights
By Staff -- Test & Measurement World, 9/1/2005
Debuts run gamut from sockets to systems
Semicon West, July 11–15, San Francisco, CA, www.semi.org.
Aries Electronics (www.arieselec.com) highlighted a new high-frequency test socket for devices ranging from 28 to 40 mm2. The socket can test devices with pitches down to 0.5 mm at frequencies from 1 to 18 GHz. Synergetix (www.synergetix.com) highlighted the development of a new 0.4-mm probe for BGA, LGA, QFN, and QFP test sockets. The company also demonstrated a 0.5-mm offset Kelvin probe that allows test engineers to measure package resistance to 1 mÙ while taking advantage of conventional DUT-board designs. In addition, the company described its Compliance Plus probe, which features increased travel to help test engineers deal with printed-circuit-board warpage.
The Semiconductor Test Consortium (www.semitest.org) confirmed Apria Technology (www.apriatech.com) has started shipping its OC800 OpenStar-compliant baseband arbitrary waveform generator (AWG) and digitizer modules. Agilent Technologies (www.agilent.com) introduced its Versatest Series Model V5500, which targets single-insertion final-test applications for multichip-package (MCP) devices and discrete flash memory. The Versatest V5500's tester-per-site architecture and optional Programmable Interface Matrix optimize single-insertion testing of MCPs with multiple memory types (flash, DRAM, and SRAM), supporting up to 16,384 pins per test head. ProductionLine Testers (www.productionlinetesters.com) demonstrated its IC-100 general-purpose benchtop semiconductor tester, which can mate with a handler or prober to provide a zero-footprint manufacturing test system.
GuideTech (www.guidetech.com) announced that its Femto 2000 continuous timing interval analyzer (CTIA) system has passed qualification as a certified open-architecture timing solution for the Teradyne (www.teradyne.com) Flex ATE platform. Advantest (www.advantest.com) introduced a digital module designed to enable low-cost, flexible testing of system-on-chip (SOC) devices incorporating serializer/deserializer communications interfaces. The new 6.5-Gbps digital module for the T2000 open-architecture test platform can accommodate SOCs employing a variety of Serdes standards, including PCI Express, SATA, XAUI, and FBDIMM (Fully Buffered Dual Inline Memory Module), as well as source-synchronous devices.
Johnstech (www.johnstech.com) demonstrated a variety of products that address the challenges of testing in lead-free environments. The company's ROL200 Series production-test contactors employ a self-cleaning wipe function and an elastomer-based design to minimize oxide build-up and provide controlled contact force. Kulicke & Soffa (www.kns.com) announced two epoxy probe-card process technologies—involving a new probe-needle material and a scrub-optimization process—that address the challenges posed by circuit-under-pad (CUP) devices during wafer testing.
X-Tek Systems (www.xtekxray.com) exhibited its new Revolution real-time microfocus x-ray system, which offers a viewing angle to 75° over its 16x16-in. manipulator scan area. Banner Engineering (www.bannerengineering.com) spotlighted its D10 series of compact, DIN-rail-mountable fiber-optic sensors. Cognex (www.cognex.com) introduced the newest member of its wafer ID reader family, the In-Sight 1721. Machine Vision Products (www.visionpro.com) showcased the Supra M automated optical inspection system, which provides solder-joint inspection and measurement capabilities.
Suss MicroTec (www.suss.com) demonstrated its BlueRay semiautomatic wafer-probe system for optoelectronic devices. Cascade Microtech (www.cmicro.com) highlighted its new eVue digital-imaging system, which employs a multi-CCD microscope with high-definition digital video to provide support for semiconductor navigation and testing. FormFactor (www.formfactor.com) announced full-volume commercial production of its FormFactor NF150S wafer probe card for large-area arrays tailored to the growing NAND flash market.
Read more details on these Semicon West products. See, "Failure analysis gains electrical, microscopy tools," for information on failure-analysis tools described during Semicon West.
