IPC and JEDEC to host "lead free" conference
Staff -- Test & Measurement World, 11/1/2005
IPC and JEDEC have announced that they will host the 11th International Conference on Lead Free Electronic Components and Assemblies in Boston, MA, from December 6 to 8. The goal is to help the industry prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability, and increased assembly costs.
Workshop topics will include protocols for WEEE and RoHS compliance, best practices in implementing lead-free assembly, and strategies for ensuring the reliability of solder attachments, PCBs, and components.
Conference topics will include case studies in RoHS compliance, aerospace industry response to the global transition to lead-free solder, impact of RoHS compliance on exempt industries, and lead-free assembly and miniaturization.
Additional lead-free conferences are planned for 2006 at locations in the US (Santa Clara, CA, and Austin, TX), Sweden, Singapore, and Germany. www.ipc.org/leadfreeNA.
