Show Highlights

Nepcon China, April 4–7, Shanghai, Reed Exhibitions, www.nepconchina.com.

Nepcon China helped reinforce China's reputation as the world's factory floor, at least with respect to printed-circuit boards and subassemblies. Only one exhibit fully addressed design: Asset InterTech (www.asset-intertech.com) was on hand to emphasize the importance of boundary-scan design-for-test tools. Emphasizing China's role in manufacturing, Aeroflex and Anritsu, known in North America for their communications test products, were demonstrating manufacturing tools: Aeroflex (www.aeroflex.com) highlighted its 4250 manufacturing test system, while Anritsu (www.anritsu.com) demonstrated its MK5400 solder-paste inspection system.

Many vendors enlisted the aid of complementary organizations to present their message to a Chinese audience. BP Microsystems (www.bpmico.com) highlighted its ISP-PRO device-programming socket module in conjunction with Wong's Kong King International Holdings (www.wkkintl.com). Also under the WKK banner, Phoenix|x-ray (www.phoenix-xray.com) presented its Microme|x submicron high-resolution semiautomatic x-ray system for the inspection of solder joints and electronic devices. VJ Electronix (www.vjelectronix.com) presented a paper on addressing rework challenges in lead-free processes and, in the WKK booth, displayed its Summit 1800 rework system.

ViTechnology (www.vitechnology.com), which was hosted by American Tec (www.autroncorp.com/co.html), presented its Vi-5000 Series AOI machines. In addition, SZ Testsysteme (a division of Credence Systems, www.credence.com), Aehr Test Systems (www.aehr.com), and Scorpion Technologies (www.scorpion-tech.com) all exhibited under the Jointech Trade & Development Co. (www.jointech.com.cn) banner.

Agilent Technologies (www.agilent.com) demonstrated versions of its Medalist in-circuit test systems and Medalist 5DX automated x-ray inspection systems. Viscom (www.viscom.de) demonstrated products including its X8011 inline-capable x-ray inspection system. Machine Vision Products (www.visionpro.com) demonstrated its GEM inspection system. X-Tek Systems (www.xtekxray.com) highlighted its Linx compact x-ray system for BGA, flip-chip, PCB layer alignment, and general surface-mount inspection.

Teradyne (www.teradyne.com) displayed its XStation 3-D x-ray imaging system. Elektrobit (www.elektrobit.com) featured its Tiny Test Handler, which includes a two-level conveyor that accommodates compact layouts for functional test, boundary-scan test, and software-download applications. TRI (www.tri.com.tw) displayed its TR7006L 3-D solder-paste system and TR7500DT desktop AOI system. Hamamatsu (www.hamamatsu.com) highlighted its microfocus x-ray sources and camera units.

CyberOptics (www.cyberoptics.com) presented products such as its Flex AOI system. Omron (www.omron.com) displayed AOI systems for PCB inspection applications. Seica (www.seica.com) highlighted its flying-probe and other PCB test systems. Digitaltest(www.digitaltest.net) showcased its MTS180 board-test system. And YESTech (www.yestechinc.com) highlighted its line-up of AOI and AXI systems.

SAE 2006, April 3–7, Detroit, MI, Society of Automotive Engineers, www.sae.org.

SAE 2006 marked the Society of Automotive Engineers' 101st annual gathering. The SAE estimated that 35,000 visitors representing more than 45 countries converged on Detroit's Cobo Arena during the event.

The 2006 technical program offered 1500 papers, including about 400 test-related papers on topics including vehicle reliability, noise and vibration, vehicle aerodynamics, automotive lighting, occupant restraints, six sigma, brake technology test, and innovations in passive safety. Six new test seminars for SAE 2006 focused on tires and wheels, accident reconstruction methods, kinematics in rollovers, and powertrain and propulsion testing.

Products on display included a digital sensing data-acquisition system for vehicle and engine noise measurement from the Larson Davis (www.larsondavis.com) division of PCB Piezotronics, the PCI-6230 from National Instruments (www.ni.com) for isolated data acquisition with industrial sensors, the Laser Tracker X for measuring large parts and assemblies from FARO Technologies (www.faro.com), Boxboro Systems' (www.boxborosystems.com) and Robert A. Denton, Inc.'s (www.radenton.com) joint release of the RibEye deflection measurement system for monitoring crash-test dummies, and the TSD-100 two-zone thermal shock chamber from Espec (www.espec.co.jp).