Rudolph ships wafer-inspection system
Staff -- Test & Measurement World, 8/1/2006
Rudolph Technologies has announced the first shipment of its all-surface macro-defect detection system to a US-based manufacturer of flash memories. The system, which will be installed in a quality-assurance environment, combines the wafer front-side inspection capability of the AXi 935 Macro Defect Inspection tool with the edge inspection capability of the recently introduced E25 Wafer Edge Inspection module.
"The combination of the AXi 935 and E25 on a single platform accommodates automatic inspection of both the front surface and edge of the wafer in a single system without significantly impacting inspection throughput. The inspection data can be fed forward for automatic disposition of both wafers and die for quality assurance." said Ardy Johnson, VP of marketing for Rudolph.
The E25 Wafer Edge Inspection module includes several new features, including increased surface coverage, simplified recipe creation, and an improved detection algorithm for edge chips and cracks. Modules are also available for wafer backside inspection. www.rudolphtech.com.
