Show Highlights
Staff -- Test & Measurement World, 8/1/2006
From RF wafer probing to base-station testing
International Microwave Symposium, June 11–16, 2006, San Francisco, CA, IEEE Microwave Theory and Techniques Society, www.ims2006.org.
Suss MicroTec (www.suss.com) demonstrated its new |Z| RF probe card for production test as well as its new SussCal Professional wafer-level high-frequency calibration software. Rohde & Schwarz (www.rohde-schwarz.com) introduced the FSUP, an instrument that combines a spectrum analyzer and phase-noise tester, and the AFQ100A, an I/Q modulation generator. The company also debuted enhanced Bluetooth and cable-measurement capabilities, test support for mobile WiMAX and WiBro, and code-domain-power test capability.
Aeroflex (www.aeroflex.com) introduced its 3280 series of 3-Hz to 3-GHz, 13.2-GHz, and 26.5-GHz spectrum analyzers, which achieve accuracies of ±0.15 dB up to 3 GHz. Giga-tronics (www.gigatronics.com) introduced its Panther 2500 series signal generators, which provide phase noise of –111 dBc at 10-kHz and 100-kHz offsets on a 10-GHz carrier frequency. Agilent Technologies (www.agilent.com) announced several new design and measurement products for microwave and wireless research and development, including MIMO analysis capability and new network-analyzer options and its new 3-D electromagnetic design and verification software, EMDS.
Anritsu (www.us.anritsu.com) introduced WiMAX capability for its Signature signal analyzer. The company also added an interference analyzer and channel scanner to its UMTS Master Node B analyzer and Spectrum Master handheld spectrum analyzer, debuted a low-cost 7.1-GHz spectrum analyzer, and combined the measurement features necessary for cell-site installation and maintenance into its BTS Master handheld base-station analyzer.
Chip quality spans design, test, and inspection
Semicon West, July 11–13, 2006, San Francisco, CA, SEMI, www.semi.org.
Verigy (www.verigy.com) made its trade show debut and announced that it is extending its joint development work with Cadence Design Systems (www.cadence.com) to optimize design and test links. Nextest Systems (www.nextest.com) introduced the Magnum Grande, which provides up to 7680 I/O pins deployed over 960 sites for flash test. Advantest (www.advantest.com) introduced a 16-channel mixed-signal module, dubbed the Base Band Waveform Generator Digitizer (BBWGD), for its OpenStar-compliant T2000 test system, while the Semiconductor Test Consortium (www.semitest.org) highlighted OpenStar modules from Advantest and Apria Technology (www.apriatech.com).
Suss MicroTec (www.suss.de) introduced a field-upgrade capability for its BlueRay probe system. Multitest (www.multitest.com) demonstrated the InFlip MEMS strip-test module for three-axis low-g accelerometers. Johnstech (www.johnstech.com) highlighted gold-plated contacts for the Pad ROL200 contactor and announced its new Edge Test Contactor Division, which will address the memory-module market. Eagle Test Systems (www.eagletest.com) touted its announcement that Linear Technology (www.linear.com) has bought multiple ETS-364 systems. GuideTech (www.guidetech.com) teamed with KVD (www.kvdco.com) to demonstrate a low-cost test approach for devices with high-speed I/O.
ALIS (www.aliscorporation.com) demonstrated its LookingGlass LG-2 helium-ion microscope. Cognex (www.cognex.com) highlighted its In-Sight Explorer network automation software, which includes tools to manage a system of networked In-Sight wafer readers. X-Tek (www.xtekxray.com) announced the addition of computerized tomography to its Revolution system.
Vistec (www.vistec-semi.com), the former Leica Microsystems Semiconductor, highlighted the LDS3300 wafer edge and backside inspection system and its OEM microscope modules. Rudolph Technologies (www.rudolphtech.com) announced a repeat order for the NSX 115 macro defect inspection systems.
UMD Advanced Test Technologies (www.umdtech.com) exhibited burn-in and thermal-management products and also announced it has signed a letter of intent to merge with Antares conTech (www.antarescontech.com), a provider of sockets and connectors for the semiconductor industry. The combined company will be named Antares Advanced Test Technologies and will be headquartered in Vancouver, WA.
