Show Highlights

International Test Conference, October 23–27, Santa Clara, CA. IEEE. www.itctestweek.org.

Synopsys (www.synopsys.com) announced links between its TetraMAX ATPG tool and Odyssey yield-management system. It also announced a collaborative effort with Virage Logic (www.viragelogic.com) on a test-reference design flow for testing and repairing embedded memories for SOC designs.

The Semiconductor Test Consortium (www.semitest.org) reported that it has created the Docking and Interface Working Group (DIWG) to develop ATE peripheral interface standards. Corelis (www.corelis.com) demonstrated its ScanExpress boundary-scan test and programming system.

Mentor Graphics (www.mentor.com) announced the release of TestKompress 2007, which offers improvements in ATPG productivity. Mentor also announced that its YieldAssist tool now supports an automated, server-based use model for high-volume diagnosis of wafer test failures. LogicVision (www.logicvision.com) unveiled its ScanBurst tool and announced that it has partnered with Mentor to deliver at-speed test for high-speed nanometer designs.

Electroglas (www.electroglas.com) reported that King Yuan Electronics (www.kyec.com) has qualified the Electroglas EG6000 for production probing of 300-mm wafers. OptimalTest (www.optimaltest.com) unveiled its Test Management Solutions (TMS) software for managing the entire IC testing process.

JTAG Technologies (www.jtag.com) announced that its ProVision software now supports tests based on the IEEE 1149.6 standard for digital networks. Goepel electronic (www.goepel.com) introduced a new GUI for its System Cascon boundary-scan software; the GUI features a “Multi-Phase-Inspector” that supports product life-cycle functions.

Nextest Systems (www.nextest.com) announced its Magnum iCP for high-volume test of CMOS image-sensor (CIS) devices. The tester integrates logic test with image-capture and image-analysis hardware. A light source and a wafer prober enable users to probe up to forty 256-Mpixel CIS devices in parallel. Test Systems Strategies Inc. (www.tessi.com) highlighted a partnership with Toshiba Microelectronics (www.toshiba.co.jp/tosmec) and ATE Service (www.ate.co.jp).

Asset InterTech (www.asset-intertech.com) debuted a controller card that handles JTAG and functional test chores. It also announced ScanWorks enhancements. Cadence Design Systems (www.cadence.com) demonstrated the new Logic Design Team Solution suite. ARM (www.arm.com) highlighted its emBISTRx embedded-memory test and repair system.

Intellitech (www.intellitech.com) announced support for Xilinx Virtex 4 RocketIO and for Asset Intertech ScanWorks, and it debuted a thumb-sized SystemBIST demo board. Verigy (www.verigy.com) and Test Insight (www.testinsight.com) announced the Verigy STIL Reader/Writer for creating and debugging test programs used with Verigy’s V93000 SOC tester.

Electronica, November 14-17, Munich, Germany. Messe München. www.electronica.de.

Aeroflex (www.aeroflex.com) announced the addition of a boundary-scan capability and a PXI software wrapper tool to its 5800 Series ATE system. The company has also added WiMax OFDMA, 1xEvDO, and HSUPA test capabilities to its PXI 3000 Series platform. Digitaltest (www.digitaltest.net) demonstrated new features for its Condor, MTS300 Sigma, and MTS 180 systems. Teradyne (www.teradyne.com) demonstrated the new UltraPin II 121 and 121a pin boards for the TestStation ICT platform and also highlighted its Debug Pro software for the platform.

Seica (www.seica.com) demonstrated functional, in-circuit, and flying-probe testers. Viscom (www.viscom.de) highlighted its S3016 PCB inspection system, its XT9000-P panoramic x-ray tube, and its new XMC software package. Goepel electronic (www.goepel.com) announced that it has added IEEE 1149.6 support to its System Cascon software.

XJTAG (www.xjtag.com) unveiled its XJTAG Professional development system. Asset InterTech (www.asset-intertech.com) and JTAG Technologies (www.jtag.com) presented to the European market products they debuted at ITC (above).

Rohde & Schwarz (www.rohde-schwarz.com) debuted the FMU36 spectrum and vector-signal analyzer, its NRP-Z81 broadband power sensor, and its R6240A DC voltage and current source/monitor. National Instruments (www.ni.com) demonstrated new high-speed digital I/O instruments for PCI Express and announced pioneer programs for two devices based on the NI LabView FPGA module.

Pendulum Instruments (www.pendulum-instruments.com) demonstrated the CNT-90XL microwave frequency counter/analyzers that operate to 60 GHz. Pickering Interfaces (www.pickeringtest.com) highlighted its LXI microwave matrix products.

Vision 2006, November 7–9, Stuttgart, Germany. Messe Stuttgart. www.messe-stuttgart.de/vision.

Seldes (www.seldes.com) debuted the Chameleon-Link II and Chameleon-Link E frame grabbers, launched its Cougar embedded acquisition systems, and highlighted a partnership with The MathWorks (www.mathworks.com) for building FPGA-based image-processing applications. Dalsa (www.dalsa.com) announced the X64 Xcelera line of PCI Express frame grabbers and demonstrated its Piranha Color line-scan model for PCB inspection. Dalsa’s ipd group (www.goipd.com) demonstrated the VA15 vision appliance for single-camera applications.

Sony Europe’s Image Sensing Division (www.sonybiz.net/vision) launched the monochrome XCI-V3. National Instruments (www.ni.com) demonstrated new PCI Express frame grabbers. Pleora Technologies (www.pleora.com) highlighted a version of its iPORT software that provides a migration path to GigE Vision compliance. Point Grey Research (www.ptgrey.com) announced the opening of a Munich sales office.

Matrix Vision (www.matrix-vision.de) highlighted its mvDelta PCI Express frame grabber, its mvBlueCougar Gigabit Ethernet cameras, its mvHyperion-CLe PCI Express Camera Link frame grabber and its mvSigma-SQe four-channel frame grabber. Kappa opto-electronics (www.kappa.de) highlighted its PS series of low-noise cameras. MVTec (www.mvtec.com) demonstrated a six-axis industrial robot equipped with two cameras.

VCubed (www.smartledlighting.com) introduced its “Smart Design Concept,” which integrates thermal management, LED failure detection, current control, and strobe control in LED illumination systems. e2v technologies (www.e2vtechnologies.com) announced that it has won a flight-phase contract to supply the European Space Agency with CCD image sensors for an instrument on the Gaia satellite.

Silicon Software (www.silicon-software.de) demonstrated its VisualApplets programming tools. Matrox Imaging (www.matrox.com) launched Solios GigE—the company’s first interface card for the GigE Vision standard. Thirty new GigE Vision- and GenICam-compliant cameras highlighted Basler Vision Technologies’ (www.basler-vc.com) exhibit. Vision Components (www.vision-components.com) and SAC (www.sac-vision.net) announced their cooperation on the development of the EyeSpector 1.4 (www.eyespector.com) machine-vision system.