Maximize your printed-circuit-board test coverage

-- Test & Measurement World, 5/25/2007 4:25:00 AM

Find helpful hints on how to optimize your deployment of test resources in the archive Webcast “Test Coverage Decisions for the Printed Circuit Assembly Factory.” Presenter Arden Bjerkeli, director of customer applications support at Asset InterTech, describes the pros and cons of IEEE 1149 JTAG boundary scan, optical and x-ray inspection, and in-circuit and functional electrical test. The Webcast, for which chief editor Rick Nelson served as moderator, was presented live on May 23. View the Webcast here.

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