Productronica: Lloyd Doyle announces wafer-scale bump-inspection system

-- Test & Measurement World, 11/20/2007 6:44:00 AM

Lloyd Doyle, a maker of PCB inspection equipment, said at Productronica that it has released its IBIS-Versalea, a new system aimed at silicon-wafer bump inspection.

Versalea builds on Lloyd Doyle’s recently released IBIS technology, which powers a high-speed interferometer-based system for solder-bump inspection of IC substrates. IBIS uses conventional interferometry combined with massive parallel data processing to give a production-scale inspection tool capable of inspecting and reporting on 3000 bumps per second. The IBIS range now comprises prototype and production units for substrate inspection in the form of IBIS-lab and IBIS, while the Versalea will be capable of handling 300-mm wafers and all combinations of substrates in panel format.

www.lloyd-doyle.com

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