AOI, AXI, and other inspection products touted at Productronica
-- Test & Measurement World, 11/26/2007 12:56:00 PM
New inspection products at Productronica included AOI systems, x-ray systems, wafer-bump-inspection systems, and related software from companies including MatriX, Dage, Lloyd Doyle, Yxlon, Phoenix|x-ray, and Viscom.
MatriX Technologies debuted the X2.5 addition to the company’s AXI product lineup. The X2.5 features a programmable angle-shot capability that, when combined with the MatriX Slice-Filter Technology (SFT), provides for 100% test coverage of double-sided PCBs. MatriX also introduced new MIPS_Process software, which adds a module that can correlate different inspection points in the SMT line.
Dage Precision Industries introduced an enhanced cold-bump-pull (CBP) bond-testing capability as well as x-ray systems. The second-generation CPB capability for the company’s 4000HS high-speed bond tester offers advantages over conventional shear testing. Dage also announced the new XiDAT XD7500NT digital x-ray inspection system, which offers sub-micron inspection capability over 18 x 16-in. inspection area. In addition, the company highlighted its new XiDAT XD7800 large-board-format digital x-ray inspection system.
Lloyd Doyle released its IBIS-Versalea, a new system aimed at silicon-wafer bump inspection. Versalea builds on Lloyd Doyle’s recently released IBIS technology, which powers a high speed interferometer-based system for solder bump inspection of IC substrates.
Yxlon International Feinfocus presented its Y.Cougar Pro x-ray inspection system, its Y.QuickScan fast CT capability, and its T.FGUI 3.0 software. Y.Cougar Pro supports manual and fully automated 2-D and 3-D inspection. Y.QuickScan shrinks CT scan times to 18 seconds while supporting 3-D reconstruction in 2 minutes. Y.FGUI 3.0 software supports real-time x-ray image analysis.
Phoenix|x-ray showcased its x|act software platform for CAD-based fully automated inspection of solder joints. The software requires only a one-time configuration and can be used with all phoenix|x-ray systems. Also on display was the microme|x, an AXI-capable inspection system that combines high-quality automated 2-D x-ray inspection and 3-D computed tomography in one system.
Viscom introduced its new S3088-II high-speed AOI system; it includes Viscom’s 8M AOI camera technology, which at 20 fps provides up to 25% faster image upload while offering full color capability. Viscom also highlighted the MX family of IR semiconductor inspection systems, which it acquired last summer from Phoseon Technology.
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