MatriX Technologies has expanded its automated x-ray inspection (AXI) line-up with the addition of the X2.5. The X2.5 features a programmable angle-shot capability and is suitable for high-throughput automatic solder-joint inspection of double-sided PCBs.

The company says that the angle-shot capability combined with the MatriX Slice-Filter Technology (SFT) provides for 100% test coverage of double-sided PCBs. SFT, which discerns hidden or overlapped joints, employs a proprietary algorithm to separate image data for each side of a double-sided PCB without requiring the use of 3-D laminography techniques.

MatriX Technologies, www.m-xt.com.