Inspection system employs interferometry
Staff -- Test & Measurement World, 12/1/2007
Lloyd Doyle, a maker of PCB inspection equipment, has released the IBIS-Versalea, a system designed for silicon-wafer-bump inspection. Versalea builds on Lloyd Doyle’s IBIS technology, which powers a high-speed interferometer-based system for solder-bump inspection of IC substrates.
IBIS uses conventional interferometry combined with massive parallel data processing to create a production-scale inspection tool capable of inspecting and reporting on 3000 bumps per second. The IBIS range now comprises prototype and production units for substrate inspection in the form of IBIS-lab and IBIS, while the Versalea will be capable of handling 300-mm wafers and all combinations of substrates in panel format.
Lloyd Doyle, www.lloyd-doyle.com.
