Production show highlights electronics inspection and test

JTAG Technologies highlighted a new USB version of its JT 3705 Explorer—the JT 3705/USB Explorer provides two boundary-scan Test Access Ports (TAPs), which can be synchronized and are suitable for running a complete battery of board test and programming operations. Digitaltest showcased its second-generation Condor 500 flying prober, which is based on a shuttle concept that facilitates front board loading. The company also presented a version of its MTS Lambda in-circuit tester, which doubles throughput.

Aeroflex and Goepel electronic announced that the Aeroflex 5800 Series multiconfiguration, multifunction ATE system is optionally available with Goepel’s PXI-based ScanFlex JTAG/boundary-scan platform. Goepel also announced it has developed a new series of JTAG/boundary-scan controllers with LXI interfaces (See our article, SOC ATE gains RF instrumentation). Agilent Technologies announced a partnership to license certain automotive-network products in the Elektrobit FlexRay product line. Rohde & Schwarz introduced its SFE100 test transmitter, which targets production test of set-top boxes, TV sets, and other broadcast terminal units, and the company debuted the CMW500 nonsignaling tester for wireless devices operating to 6 GHz.

Teradyne introduced its TestStation Duo concurrent in-circuit tester, which combines two independent test modules inside a single tester frame to enable manufacturers to perform simultaneous testing of two printed-circuit boards (PCBs). LDS Test and Measurement highlighted its Dimension 4i data-acquisition system, which combines technologies that LDS gained with its acquisition of Dactron, Nicolet Technologies, and Gould Instruments.

MatriX Technologies debuted the X2.5 addition to its AXI product lineup—the system features a programmable angle-shot capability that, combined with the MatriX Slice-Filter Technology (SFT), provides for 100% test coverage of double-sided PCBs. MatriX also introduced new MIPS_Process software, which adds a module that can correlate inspection points along a PCB manufacturing line. Dage Precision Industries introduced an enhanced cold-bump-pull (CBP) bond-testing capability as well as x-ray systems. The second-generation CBP capability for the company’s 4000HS high-speed bond tester offers advantages over conventional shear testing. Dage’s new XiDAT XD7500NT digital x-ray inspection system offers submicron inspection capability over an 18x16-in. inspection area. Also, the company touted its new XiDAT XD7800 large-board-format digital x-ray inspection system.

Yxlon International Feinfocus presented its Y.Cougar Pro x-ray inspection system, its Y.QuickScan fast computed tomography (CT) capability, and its T.FGUI 3.0 software. Y.Cougar Pro supports manual and fully automated 2-D and 3-D inspection. Y.QuickScan shrinks CT scan times to 18 s while supporting 3-D reconstruction in 2 min. Y.FGUI 3.0 software supports real-time x-ray image analysis. Phoenix|x-ray showcased its x|act software platform for CAD-based automated inspection of solder joints. Also on display was the microme|x, an AXI-capable inspection system that combines high-quality automated 2-D x-ray inspection and 3-D CT in one system.

Viscom introduced its new S3088-II high-speed AOI system; it includes Viscom’s 8M AOI camera technology, which at 20 fps provides up to 25% faster image upload while offering full color capability. Viscom also highlighted the MX family of IR semiconductor inspection systems, which it acquired last summer from Phoseon Technology. Lloyd Doyle said it has released its IBIS-Versalea, a new system aimed at silicon-wafer bump inspection. Versalea builds on Lloyd Doyle’s recently released IBIS technology, which powers a high-speed interferometer-based system for solder-bump inspection of IC substrates.