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Luminous growth in MEMS test equipment market

Sujan Sami, Senior Research Analyst, Frost & Sullivan, www.frost.com -- Test & Measurement World, 2/1/2008

Microelectromechanical systems (MEMS) include several mechanical elements, such as sensors and actuators, that are integrated on a common silicon substrate through microfabrication technology. MEMS can also be referred to as smart matter, micromachines, or microsystems technology (MST).


Test equipment for optical and inertial MEMS devices generated worldwide revenues of $56.5 million in 2007, with inertial MEMS equipment making up the majority of the total. Note: All figures are rounded.
The MEMS industry has witnessed large growth rates in recent years in applications including cell phones, digital still cameras, camcorders, laptops, MP3 players, and robots. The market for MEMS device test, however, has not grown significantly in comparison to the growth of the MEMS device market itself. One reason for that lack of growth remains the lack of education among end users on the importance of testing MEMS devices.

Dual testing of MEMS devices

MEMS devices contain electrical and mechanical components. In today's testing environment, it is much easier to test the static electrical characteristics using test methods such as wafer probing, electrical trimming, and final test at temperature. Mechanical testing verifies the resistance to mechanical shock, stiction, and other MEMS-specific failure modes.

The vendors in the MEMS test market face a huge challenge to perform dynamic testing on the MEMS devices. A new generation of test equipment is required for testing under severe conditions—such as high temperature, pressure, and humidity—and the new equipment must account for stiction, which refers to the friction between moving parts inside a chip due to factors such as over-range of input signals or electromechanical instabilities.

Wafer-level testing

Testing of MEMS devices at an early production or preproduction stage is essential to reducing production costs and time to market. Once the packaging is complete, any test results for a failed device will lead to an increase in production costs. The market is slowly moving toward a situation where there are several solutions available for testing MEMS devices under environments such as high pressure, near-vacuum, and severe temperatures.

The testing of the sensor elements of either inertial MEMS or optical MEMS (MOEMS) is critical before the packaging is done. (MOEMS are used in applications such as IR imagers, spectrometers, bar-code readers, maskless lithography, adaptive optics, and automotive heads-up display.) But certain challenges exist when performing testing at an earlier stage, including trying to simulate the exact environment under which the device might be used at a later stage. In addition, the lack of standards and specific test equipment extends the challenge to test these MEMS devices. Currently, there is little off-the-shelf MEMS test equipment in the market.

In a recent market study, we found that the total world MEMS test-equipment market generated revenues of $56.5 million in 2007, which represented a growth rate of 10.1% over the previous year. In 2007, test equipment for inertial MEMS and MOEMS contributed approximately 60% and 40%, respectively.

 

PCB book-to-bill

The book-to-bill ratios for the North American rigid printed-circuit board (PCB) industry and combined rigid and flex PCB industries each stood at 1.06 in November, with both down from 1.08 in October. The North American flexible circuit book-to-bill fell back to 1.02 in November, down from 1.10 in October. www.ipc.org.


UWB market to take off

The market for ultrawideband (UWB) silicon is finally beginning to take off, reports In-Stat. Although regulatory hurdles over UWB still persist worldwide, the first UWB-enabled notebook PCs shipped in 2007, the market-research firm says in the $3695 report, “Ultrawideband 2007: PCs Finally Hit the Global Market.” The report predicts that more than 400 million UWB-enabled devices will ship in 2011. www.in-stat.com.


Semiconductor equipment book-to-bill

North American-based manufacturers of semiconductor equipment posted $1.15 billion in orders in November 2007 (three-month-average basis) and a preliminary book-to-bill ratio of 0.82. The ratio (final) stood at 0.80 in October. The November bookings figure is about 2% less than the final October 2007 level of $1.18 billion and about 19% less than the $1.43 billion in orders posted in November 2006. www.semi.org.

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