IBM, AMD demo first "full field" EUV test chip

The industry leaders show the results of their work to integrate the capabilities of EUV lithography into a standard fab process flow.

Ann Steffora Mutschler, Senior Editor -- Electronic News -- Test & Measurement World, 2/26/2008 12:38:00 PM

At the SPIE Advanced Lithography conference being held this week in San Jose, research partners Advanced Micro Devices (AMD) and IBM announced a working test chip that uses extreme ultra-violet (EUV) lithography for the critical first layer of metal connections across the entire chip, compared to previous projects that utilized EUV for working chip components that were only “narrow field” and covered just a small portion of the design.

The work for the test chip was performed by AMD, IBM, and other partners at the UAlbany NanoCollege’s Albany NanoTech Complex, and the paper for it will be presented by Dr. Bruno La Fontaine of AMD at the SPIE conference today.

Read the complete story on the EDN Web site.