Agilent at APEX unveils AOI platform for SMT line inspection
-- Test & Measurement World, 4/10/2008 7:02:00 AM
Agilent Technologies at APEX introduced a new automated-optical-inspection (AOI) platform and showcased its new powered vectorless test capability, a high-speed solder-paste inspection system, a 3-D inline x-ray inspection system, an in-circuit tester, and process-control software tools.
The new Medalist sj5000 is fully qualified for all areas of surface-mount-technology (SMT) line inspection, including post-reflow, pre-reflow, and 2-D inspection capabilities. Developed to tackle today’s complex and shrinking printed-circuit-board assemblies, the Medalist sj5000 can inspect the smallest 01005 components, with no compromise in speed and resolution.
“With the latest qualification of our pre-reflow and 2-D paste inspection capabilities, we again have a platform that can be integrated into all areas of the production environment,” said Daniel Mak, VP and GM of the Measurement Systems Division. “We also are investing in the development of new AOI capabilities at our key knowledge centers around the world, and are committed to delivering the highest quality and greatest value to our customers.”
Agilent also exhibited its VTIP v2.0 Powered Cover Extend technology for the i3070 in-circuit testers, which combines boundary scan and Agilent’s VTEP technology. The company also highlighted its SP50 high-speed, 3-D solder-paste inspection system, its Medalist x6000 automated 3-D x-ray inspection system, its Medalist i1000 low-cost in-circuit test system, and process-control software that closes the loop between manufacturing and test.
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