YESTech upgrades automated PCB inspection system
-- Test & Measurement World, 7/22/2008 11:38:00 AM
Aimed at high-volume or high-mix manufacturing environments, the F1 Series automated optical inspection system from YESTech provides automated inspection of solder and lead defects, component presence and position, correct part, polarity, and through-hole parts on printed circuit boards. According to the manufacturer, the upgraded AOI system helps to increase throughput, improve quality, and reduce costs. It is also equally effective for pre- and post-reflow applications.
The system’s four oblique viewing cameras offer critical inspection capabilities for R-nets and other difficult-to-inspect parts. The improved Fusion Lighting, with multicolor solder joint inspection, delivers 20 percent higher detection capabilities than previous models. Fusion Lighting and advanced image processing technology integrate several techniques, such as color, normalized correlation, and rule-based algorithms, to provide complete inspection coverage with a low false failure rate. The F1 Series offers off-line programming and uses a standard package library to simplify training and ensure program portability across manufacturing lines. Real-time SPC monitoring is a standard option.
YESTech, www.yestechinc.com.
