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Evaluating printed-circuit-board test options
March 26, 2008
“For a printed circuit board (PCB) manufacturer, testing presents a wide variety of both problems and opportunities,” writes Daniel Snedigar in the article “Practice makes perfect,” posted on the IPC Website. “Test too much,” Snedigar writes, “and you waste capital…and lose production efficiency. Test too little, or in the wrong ways, and you ship bad products, or lose time isolating problems in your processes.”
PCB test will be the topic of the Test and Inspection Summit panel I will moderate next week at the IPC’s Apex trade-show in Las Vegas. In Snedigar’s article, he quotes several of the panel participants: Jack Rozwat, GM of Agilent Technologies’ Americas Electronics Measurement Test Field Operations; Glenn Woppman, president and CEO of Asset InterTech; and John VanNewkirk, president and CEO of CheckSum.
He also quotes me as saying, “There is no recipe for how much optical inspection you need, and how much x-ray inspection you need, how much boundary scan, and how much electrical testing you need. This is all a matter of art.”
Other participants include Steve Case, chairman and founder, CyberOptics; Chad Hankinson, president, Fixture Services Group, Everett Charles Technologies; and Don Miller, president, YesTech.
If you are in Las Vegas next week (Thursday, April 3, 10:15 am to 11:45 am at the Mandalay Bay Resort & Conference Center), you can participate in the discussion. If you can’t be there, add your comments to this blog.
Posted by Rick Nelson on March 26, 2008 | Comments (1)
