APEX summit to highlight test and inspection

Inspection, in-circuit board test, and functional test will play an evolving role in printed-circuit-board and electronic-assembly production, as I suggest in my “Design, Test & Yield” column in the March issue of Test & Measurement World. Industry executives will scrutinize that evolving role during the Test and Inspection Summit, Wednesday, April 1, 1:30 pm–3:30 pm, which takes place as part of IPC APEX Expo 2009 in Las Vegas. Building on the 2008 Test and Inspection Summit, participants will bring you up-to-date on the latest test challenges and the technologies that are emerging to deal with them, including in-circuit electrical test, optical inspection, x-ray inspection, functional electrical test, and JTAG/boundary-scan test.

I’ll serve as moderator; here are the panelists:

• David Buhrkuhl, president, SPEA America;
• Peter van den Eijnden, president, JTAG Technologies;
• Mark Harding, director of sales, North America, Digitaltest;
• Jack Rozwat, general manager, SST Americas Field Operations, Agilent Technologies;
• Carsten Salewski, president and CEO, Viscom; and
• Phil Vere, managing director for Bond Test, Dage Precision Industries.

Bring your questions.