Editorial call: Switching RF and microwave signals

Whether EDN readers are building "big-iron" RF test equipment or tiny multiband mobile devices, they need to move microwave signals around. To do that, they can make use of various kinds of RF switches, ranging from PiN diodes, electromechanical or solid-state switches, or even MEMS switches.

Some of these broad categories offer many subcategories. For example, solid switches can be implemented in GaAs or silicon-on-insulator (SoI) technologies.

To help readers sort out the options, EDN’s September 17 cover story will survey what switch technologies are available and what the consequences are of particular switch choices.

If you make, use, or provide applications support for RF/microwave switches, I’d like to hear from you. Drop me a brief note (rnelson@reedbusiness.com) commenting on any or all of the questions below:

1. What types of RF switches do you make or have experience applying?

2. What are the advantages of the switch technologies you make or use?

3. Could you comment specifically on the following issues?

• ESD susceptibility,
• parameters like insertion loss and linearity,
• printed-circuit-board real-estate requirements,
• the need for external control circuits,
• cost, and
• ease of integration with other circuit subsystems (for example, power amplifiers).

4. What are the drawbacks of the switch technologies you use? If you are a purchaser of RF switches, what would you like to see vendors provide that they are not providing now? If you make RF switches, what plans do you have for continued innovation?

5. Which technologies do you consider mature, and which offer the greatest possibilities for further innovation?

6. Are there any other comments you would like to make about RF/microwave switches?

Thanks for your help. Please send your comments this week if possible.