Cascade acquisition augments 3-D TSV efforts

The semiconductor test industry underwent a round of consolidation this morning (1 a.m. EST) when Cascade Microtech announced that it is acquiring the semiconductor test business of Suss MicroTec AG. The acquisition covers all products and intellectual property related to test, including probe stations and integrated systems, engineering probes, and 3-D TSV, MEMS, LED, optoelectronic, and cryogenic technologies.

Risto Puhakka of VLSI Research called the acquisition very doable and said Cascade could benefit from the Suss test division’s work in TSVs.

F. Paul Carlson, who has succeeded Geoff Wild as chairman and CEO of Cascade Microtech, said the recession provided Cascade with the consolidation opportunity, because of what he called the company’s strong cash position.

Cascade VP of marketing Mike Kondrat said that despite downsizing across the industry, manufacturers have continued striving to achieve smaller geometries. A lot of energy and effort is focused on 3-D TSVs; RF, analog, and power devices; and sensors. Carlson added that Cascade’s focus on “Moore’s Law and more” can help address emerging technologies and test challenges. He said that the acquisition combines Cascade’s strong precision RF background with the Suss test divisions precision mechanical background, ensuring the competency necessary to address 3-D, LED, and MEMS technologies.

In related news, Cascade and Suss MicroTec AG, former parent of the just acquired Suss test division, announced today that they have agreed to pursue a strategic alliance to address the growing device complexities of emerging semiconductor technologies such as 3-D TSV manufacturing and test.

By pursuing a strategic alliance, the two companies said they hope to bring innovative approaches to the 3-D TSV manufacturing processes. Both companies expect to use their associations with leading research organizations, such as IMEC, as well as industry partnerships, to gain insight into TSV challenges. In fact, Kondrat noted that TSV technology is perhaps advancing in Europe faster than elsewhere, due to the efforts of organizations including IMEC, and the European efforts increased the attractiveness of the Suss test division as an acquisition target.

“Suss MicroTec shares Cascade Microtech’s commitment to develop the most advanced technologies for the continued improvement of semiconductor technologies,” said Frank P. Averdung, president and CEO of SUSS MicroTec AG, in a press release. “The comprehensive knowledge of the two companies will enable both companies to better address the issues inherent in 3D integration.”

Read more here.

Updated 9:50 a.m. EST.