Apex summit on PCB- and system-test challenges of 3-D chips

IPC has announced that its annual Test & Inspection Summit will be held Tuesday April 6 from 1:30 p.m. to 3 p.m. at Apex Expo in Las Vegas. Building on the 2009 Summit, a panel of experts will discuss the latest test challenges and the technologies that are emerging to deal with challenges board and system designers will face with the emergences of 3-D chips. The panelists will discuss the role of JTAG/boundary-scan test and vectorless test techniques as well as the continued role of in-circuit electrical test, optical inspection, x-ray inspection and functional electrical test

Here’s the lineup of panelists:

–Heiko Ehrenberg, managing director, US Operations, Goepel Electronics;

–Chad Hankinson, president, Fixture and Services Group, Everett Charles Technologies;

–David Levine, national sales manager, Seica;

–Jack Rozwat, general manager, EMT Americas, Agilent Technologies;

–Frank Silva, Vice President, FocalSpot;

I’ll serve as moderator. If you can’t make the event, send me questions you would like to ask the panelists. Please put “Apex Test Summit” in the subject line.

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