Industry news, industry trends, and applications for engineers involved in production testing of wafers, semiconductors, printed circuit boards, and subsystems.
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Add-ins customize Agilent compliance software
February 10, 2012An enhancement to Agilent's N5467A user-defined application software gives engineers the ability to develop extensions that can be plugged into existing Infiniium compliance applications. More -
Ironwood's 40-GHz device sockets 16×16-mm BGAs
February 9, 2012The SM-BGA-9006 socket is constructed with an elastomer contactor that not only offers high speed, low inductance, and high endurance, but also allows operation from −55°C to +150°C. More -
Digitizer runs 16 bits at high speed
February 8, 2012The ATS 9625 digitizer card from Alazar Tech contains two analog-input channels that simultaneously sample at speeds up to 250 Msamples/s. More -
Everett Charles group offers custom connectors
February 7, 2012Everett Charles Technologies uses a wide range of compliant technologies to deliver custom interconnects in small to large volumes through its new Compliant Connector Group. More -
Goepel adds PXI unit to LIN interface module line-up
February 6, 2012Goepel Electronic has expanded its range of LIN communication controllers for testing electronic control units with the introduction of the PXI 3078, a module that provides two LIN bus or K-Line interfaces and supports LIN specifications 1.3, 2.0, and 2.1. More -
KLA-Tencor rolls out trio of wafer inspection systems
February 6, 2012The 2900, Puma 9650, and eS800 series of inspection systems address the wide range of defect issues that new materials, structures, and design rules have imposed on manufacturers of advanced chips. More -
Waveform analyzer plug-in smokes at 50 GHz/32 Gbps so engineers can stay cool
Bill Schweber, February 2, 2012Santa Clara, CA — 86108B precision waveform analyzer module from Agilent for their 86100C/D DCA wide-bandwidth oscilloscope family targets engineers testing high-speed serial links. Agilent demonstrated the modules and hit hst at DesgiCon 2012. More -
Panel probes T&M’s tech chiefs
Rick Merritt, EE Times, February 2, 2012A DesignCon panel probed the leaders of the major test and measurement companies on a broad range of issues. All agreed test problems are becoming increasingly thorny, and at least one member of the audience gave panelists flak for not doing enough to solve customers' toughest challenges. More
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Rowe's and Columns
January 25, 2012
Engineers discuss measurements at DesignCon
Engineers have found that using just one or even two instruments isn’t...
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Taking the Measure
January 25, 2012
DesignCon 2012 Panel: Test gurus share vision to accelerate your ‘time to answer’
The countdown begins: On Wednesday next at DesignCon 2012 I’ll be...
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Taking the Measure
August 19, 2011
ESC Boston offers integration-and-test track
Systems integration and test will be the focus of a Thursday, September 29, track...
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This article is so full of technical errors, it's hard to know where to begin....
Marc Stewart– 2/11/2012 5:35:17 PM EST
in response to Microcontroller circuit calibrates current loopsInteresting article.Very helpfull to start with as I am about to start using an...
Gordon Sim– 2/3/2012 1:18:48 PM EST
in response to Build a tester around a microcontrollerT&MW announcement of 2012 winners reflect an important attribute in making any...
Vishnu Goel T&M– 2/3/2012 12:38:23 AM EST
in response to T&MW announces winners of 2012 Best in Test awardsT&M industry is facing major challenges which remain unaddressed.The testing...
Vishnu Goel T&M– 2/3/2012 12:22:37 AM EST
in response to Panel probes T&M’s tech chiefs



